Thermomechanical FEM Analysis of Sn-Bi Solder Joint During Temperature Cycling for Fine Pitch 1st Level Interconnect
- Toyohiro Aoki
- Yasuharu Yamada
- et al.
- 2025
- ICEP-IAAC 2025
Publications
33 results for Toyohiro Aoki
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- Toyohiro Aoki
- Katsuyuki Sakuma
- et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- Katsuyuki Sakuma
- Griselda Bonilla
- et al.
- 2023
- ECTC 2023
Flip Chip Joining with Injection Molded Solder Technology
- Takashi Hisada
- Toyohiro Aoki
- 2023
- EDTM 2023
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- Sayuri Kohara
- Toyohiro Aoki
- et al.
- 2022
- ITherm 2022
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
- Takashi Hisada
- Sayuri Kohara
- et al.
- 2022
- ICEP 2022
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2021
- ICEP 2021
Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology
- Toyohiro Aoki
- Katsuhiro Yoshida
- et al.
- 2021
- ICEP 2021