Journal of the IEICE

Paper

01 Aug 2015

Wafer bumping technologies

Conference paper

Through silicon via process for effective multi-wafer integration

Akihiro Horibe, Kuniaki Sueoka, et al.

ECTC 2015

Conference paper

Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

Sayuri Kohara, Toyohiro Aoki, et al.

ITherm 2022

Conference paper

Implementation challenges for scalable neuromorphic computing

Shintaro Yamamichi, Akihiro Horibe, et al.

VLSI Technology 2017

Conference paper

Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology

Toyohiro Aoki, Katsuhiro Yoshida, et al.

ICEP 2021

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