Conference paperEffects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technologyToyohiro Aoki, Takashi Hisada, et al.ICEP 2016
Conference paperFlip chip joining with low temperature solders and thermal gradient bondingToyohiro Aoki, Eiji Nakamura, et al.ICEP 2017
Conference paperHeterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumpsKatsuyuki Sakuma, Griselda Bonilla, et al.ECTC 2023
Conference paperPlating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip JoiningToyohiro Aoki, Eiji Nakamura, et al.ECTC 2020
