Scaling beyond conventional CMOS device
Meikei Ieong, Bruce Doris, et al.
ICSICT 2004
Metal-gate FinFETs were fabricated using complete gate silicidation with Ni, combining the advantages of metal-gate and double-gate transistors. NiSi-gate workfunction control is demonstrated using silicide induced impurity segregation of As, P, and B over a range of 400 mV. High device performance is achieved by integrating the NiSi metal gate with an epitaxial raised source/drain, silicided separately with CoSi 2. Process considerations for this dual silicide integration scheme are discussed. Poly-Si gated FinFETs are also fabricated and used as references for workfunction and transconductance. © 2004 IEEE.
Meikei Ieong, Bruce Doris, et al.
ICSICT 2004
Meikei Ieong, Kathryn W. Guarini, et al.
CICC 2003
Gen Pei, Jakub Kedzierski, et al.
IEEE Transactions on Electron Devices
Kuan-Neng Chen, Sang Hwui Lee, et al.
IEDM 2006