Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
Publications
60 results for Chiplets
TSV Stress Evolution Mapping using in-line Raman Spectroscopy
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Evolution of patterning materials towards the Moore's Law 2.0 Era
- Dario L. Goldfarb
- 2022
- Japanese Journal of Applied Physics
Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion
- Amlan Ganguly
- Sergi Abadal
- et al.
- 2021
- IEEE Micro
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- Hiroyuki Mori
- Sayuri Kohara
- 2021
- ECTC 2021
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- Katsuyuki Sakuma
- Dishit Parekh
- et al.
- 2021
- ECTC 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Co-package technology platform for low-power and low-cost data centers
- Konstantinos Papatryfonos
- David R. Selviah
- et al.
- 2021
- Applied Sciences