Publications

60 results for Chiplets

Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- - Minhua Lu
  - Evan Colgan
- 2024
- ECTC 2024
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- - Divya Taneja
  - Katherine Pilger
  - et al.
- 2024
- DPC 2024
Design of Analog-AI Hardware Accelerators for Transformer-based Language Models (Invited)
- - Geoffrey Burr
  - Sidney Tsai
  - et al.
- 2023
- IEDM 2023
SyncTREE: Fast Timing Analysis for Integrated Circuit Design through a Physics-informed Tree-based Graph Neural Network
- - Yuting Hu
  - Jiajie Li
  - et al.
- 2023
- NeurIPS 2023
Design of synchronous frequency dividers in 5-nm FinFET CMOS technology
- - Marcel Kossel
  - Pier Andrea Francese
  - et al.
- 2023
- Electronics Letters
Towards a Formally Verified Security Monitor for VM-based Confidential Computing
- - Wojciech Ozga
  - Guerney Hunt
  - et al.
- 2023
- MICRO 2023
The impact of Al on contact resistance and its suitability in fine pitch interconnects
- - Fee Li Lie
  - Sathya Raghavan
  - et al.
- 2023
- IMAPS 2023
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- - Griselda Bonilla
  - Brian Quinlan
  - et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- - Aakrati Jain
  - Risa Miyazawa
  - et al.
- 2023
- ECTC 2023
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- - Prabudhya Roy Chowdhury
  - Sathya Raghavan
  - et al.
- 2023
- ECTC 2023