The effect of organometallic structure
- Thomas H. Baum
- 2019
- JES
Publications
509 results at JES
Novel Polymeric Dissolution Inhibitor for the Design of Sensitive, Dry Etch Resistant, Base-Developable Resist
- Hiroshi Ito
- Elizabeth Flores
- et al.
- 2019
- JES
Kinetics of Oxygen Gas Evolution on Hydrous Rhodium Oxide Films
- Eugene J.M. O'Sullivan
- Laurence D. Burke
- 2019
- JES
Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
Electrodeposition of Nickel-Iron Alloys: 1. Effect of Agitation
- P.C. Andricacos
- C. Arana
- et al.
- 2019
- JES
Repassivation transients measured with thin film breaking electrodes
- G.S. Frankel
- B. Rush
- et al.
- 2019
- JES
Electrical Properties of AI/Ti Contact Metallurgy for VLSI Applications
- C.-Y. Ting
- B.L. Crowder
- 2019
- JES
Growth of Facet-Free Selective Silicon Epitaxy at Low Temperature and Atmospheric Pressure
- T.O. Sedgwick
- P. Agnello
- et al.
- 2019
- JES
Initiation of electroless copper plating using Pd+2/poly(acrylic acid) films
- Robert L. Jackson
- 2019
- JES
Equilibrium Carrier Density and Solubility of Antimony in Silicon
- D. Nobili
- R. Angelucci
- et al.
- 2019
- JES