Thermal stress analysis of pin grid array structures: Module and card interactions
- P.A. Engel
- J.R. Webb
- 1992
- ASME Journal of Electronic Packaging
Publications
14 results at ASME Journal of Electronic Packaging
A note on the determination of the thermal stresses in multi-metal beams subjected to temperature variations
- A.O. Cifuentes
- 1991
- ASME Journal of Electronic Packaging
Elastoplastic analysis of bimaterial beams subjected to thermal loads
- A.O. Cifuentes
- 1991
- ASME Journal of Electronic Packaging
Mechanical analysis for thermal grease enhanced modules enclosing a silicon chip
- P.A. Engel
- D.H. stmpe
- et al.
- 1989
- ASME Journal of Electronic Packaging