Publications

15 results at IRPS 2015

Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- - Mukta Farooq
  - Giuseppe La Rosa
  - et al.
- 2015
- IRPS 2015
Oxygen vacancy traps in Hi-K/Metal gate technologies and their potential for embedded memory applications
- - C. Kothandaraman
  - X. Chen
  - et al.
- 2015
- IRPS 2015
Time-integrated photon emission as a function of temperature in 32 nm CMOS
- - Andrea Bahgat Shehata
  - Alan J. Weger
  - et al.
- 2015
- IRPS 2015
Non-volatile memory as hardware synapse in neuromorphic computing: A first look at reliability issues
- - Robert M. Shelby
  - Geoffrey W. Burr
  - et al.
- 2015
- IRPS 2015
Phase-change memory: Feasibility of reliable multilevel-cell storage and retention at elevated temperatures
- - Milos Stanisavljevic
  - A. Athmanathan
  - et al.
- 2015
- IRPS 2015