Properties and Microelectronic Applications of Thin Films of Refractory Metal NitridesMarc Wittmer1985JVSTA
Summary Abstract: Microstructure and electrical conductivity of plasma deposited gold/fluorocarbon composite filmsJ. PerrinB. Despaxet al.1985JVSTA
Effects of biased cosputtering on resistivity and step coverage in tungsten silicide filmsK.W. ChoiK.Y. Ahn1985JVSTA
Formation of TiSi2 and TiN during nitrogen annealing of magnetron sputtered Ti filmsE.D. AdamsK.Y. Ahnet al.1985JVSTA
Summary Abstract: The origin of oxidation induced enhancement of Si+ sputter yield in SIMSD.J. VitkavageJ.G. Clabeset al.1985JVSTA
Electron-gun Evaporators of Refractory Metals Compatible with Molecular Beam EpitaxyM. HeiblumJ. Blochet al.1985JVSTA
Summary Abstract: Electromigration studies of al-intermetallic structuresT. KwokP.S. Hoet al.1984JVSTA