Single-chip 4×500Mbaud CMOS transceiver
- A.X. Widmer
- K. Wrenner
- et al.
- 1996
- ISSCC 1996
Publications
92 results for Alina Deutsch
Challenges raised by long on-chip wiring for CMOS microprocessor applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1995
- IEEE Topical Meeting EPEPS 1995
Thin Film Transfer Process for Low Cost MCM-D Fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1995
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Electrical performance of card-on-board interconnections for high-speed digital applications
- A. Deutsch
- C. Surovic
- et al.
- 1994
- IEEE Topical Meeting EPEPS 1994
Intra-system interconnects for digital communications
- A. Deutsch
- G. Arjavalingam
- et al.
- 1994
- ECTC 1994
Thin film transfer process for low cost mcm-d fabrication
- C. Narayan
- S. Purushothaman
- et al.
- 1994
- MCMC 1994
Dielectric anisotropy of BPDA-PDA polyimide and its effect on electrical characteristics of interconnects
- A. Deutsch
- M. Swaminathan
- et al.
- 1993
- IEEE Topical Meeting EPEPS 1993
Transmission-line Characterization with Ultrafast Optoeletromes
- G. Arjavalingam
- A. Deutsch
- et al.
- 1993
- IEE/LEOS Summer Topical Meetings 1993
Package analysis tool based on a method of moments/surface formulation
- Saila Ponnapalli
- R. Bertin
- et al.
- 1993
- ECTC 1993
A Package Analysis Tool Based on a Method of Moments Surface Formulation
- Robert Bertin
- Alina Deutsch
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology