Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Publications
26 results for Shyng-Tsong Chen
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
Porous ILD process development for sub 100nm integration
- K. Malone
- S.T. Chen
- et al.
- 2003
- ADMETA 2003
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
Processing dependent thermal conductivity of nanoporous silica xerogel films
- Anurag Jain
- Svetlana Rogojevic
- et al.
- 2002
- Journal of Applied Physics
Opportunities and challenges in ultra low k dielectrics for interconnect applications
- S. Purushothaman
- S.V. Nitta
- et al.
- 2001
- Technical Digest-International Electron Devices Meeting