Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
The electrical resistance of thin Cu films was measured in the deposition chamber. Copper was deposited on silicon dioxide surfaces to reduce surface pinning or adhesion effects and allow high mobility. The recrystalization effect occurs over a period of hours to hundreds of hours for films of 4.5 to 100 nm thickness.
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
Sung Ho Kim, Oun-Ho Park, et al.
Small
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020
Michiel Sprik
Journal of Physics Condensed Matter