J.R. Thompson, Yang Ren Sun, et al.
Physica A: Statistical Mechanics and its Applications
The electrical resistance of thin Cu films was measured in the deposition chamber. Copper was deposited on silicon dioxide surfaces to reduce surface pinning or adhesion effects and allow high mobility. The recrystalization effect occurs over a period of hours to hundreds of hours for films of 4.5 to 100 nm thickness.
J.R. Thompson, Yang Ren Sun, et al.
Physica A: Statistical Mechanics and its Applications
R. Ghez, J.S. Lew
Journal of Crystal Growth
Thomas E. Karis, C. Mark Seymour, et al.
Rheologica Acta
Ronald Troutman
Synthetic Metals