Liat Ein-Dor, Y. Goldschmidt, et al.
IBM J. Res. Dev
Electrical test structures provide a method of rapid, low-cost end-of-process metrology for both materials properties and specific process information. The results from electrical test structures for routine monitoring of key process parameters such as line width, edge-taper width, layer-to-layer alignment, and metal coverage are compared with those from traditional metrology methods. In all cases, the correlation coefficient R was near unity, R2 ≥ 0.97, demonstrating that electrical test structures have sufficient accuracy for process-control applications. For the structures used, the line width, edge-taper width, and layer-to-layer-alignment electrical measurements have uncertainties of less than 0.1 μm. The test structures are all compatible with typical thin-film-transistor (TFT) array processing.
Liat Ein-Dor, Y. Goldschmidt, et al.
IBM J. Res. Dev
Heinz Koeppl, Marc Hafner, et al.
BMC Bioinformatics
Apostol Natsev, Alexander Haubold, et al.
MMSP 2007
Yvonne Anne Pignolet, Stefan Schmid, et al.
Discrete Mathematics and Theoretical Computer Science