Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
PaperAutomated search method for AFM and profilersMichael Ray, Yves C. MartinProceedings of SPIE - The International Society for Optical Engineering
