Paper(S)PEEC: Time- and Frequency-Domain Surface Formulation for Modeling Conductors and Dielectrics in Combined Circuit Electromagnetic SimulationsDipanjan Gope, Albert E. Ruehli, et al.IEEE T-MTT
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperPersistent spectral hole burning in deuterated (formula presented)R.M. Macfarlane, R.L. ConePhysical Review B - CMMP
PaperQuantum properties of surface space-charge layerssFrank StemC R C Critical Reviews in Solid State Sciences
