Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperScanning tunneling microscopy of individual molecules: Beyond imagingJ.K. Gimzewski, T.A. Jung, et al.Surface Science
PaperMiscibility in organic/inorganic hybrid nanocomposites suitable for microelectronic applications: Comparison of modulated differential scanning calorimetry and fluorescence spectroscopyQ.R. Huang, Ho-Cheol Kim, et al.Macromolecules
