Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements

Ullrich Pfeiffer; Arun Chandrasekhar

doi:10.1109/EPEP.2003.1250004

IEEE Topical Meeting EPEPS 2003

Conference paper

27 Oct 2003

Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements

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Abstract

We have shown the variation of the RF performance of the QFN package in accordance with its high volume manufacturing and assembly process. We have also developed a distributed model for the chip-to-package interconnect.

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Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach

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Abstract

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