D.-G. Park, Z. Luo, et al.
VLSI Technology 2004
Paper
Sharp reduction of contact resistivities by effective schottky barrier lowering with silicides as diffusion sources
Abstract
An extremely low contact resistivity of 6-7 × 10-9 Ωċcm2 between Ni0.9Pt0.1Si and heavily doped Si is achieved through Schottky barrier engineering by dopant segregation. In this scheme, the implantation of B or As is performed into silicide followed by a low-temperature drive-in anneal. Reduction of effective Schottky barrier height is manifested in the elimination of nonlinearities in IV characteristics. © 2010 IEEE.
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