K. Ismail, J.O. Chu, et al.
IEEE Electron Device Letters
The minimum epitaxial layer thickness required to produce relaxed, thermally stable, Si0.7Ge0.3 buffer layer structures for high electron- and hole-mobility devices has been determined, using high resolution x-ray diffraction. A 1.4-μm-thick layer, step graded to x=0.35, is sufficiently thick so that the residual strain in a uniform composition Si 0.33Ge0.67 layer grown on top of it is essentially independent of thickness or growth temperature of the layer. Such structures are stable when annealed at 750°C.© 1995 American Institute of Physics.
K. Ismail, J.O. Chu, et al.
IEEE Electron Device Letters
J.R.A. Carlsson, L. Clevenger, et al.
Philosophical Magazine B: Physics of Condensed Matter; Statistical Mechanics, Electronic, Optical and Magnetic Properties
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Physical Review B - CMMP
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