Mixed mode double-gate FET model
P. Solomon
DRC 2001
We report on the first realization of extremely low resistivity regrown ohmic contacts to a variety of GaAs/AlGaAs structures using selective epitaxy. For planar regrown n+-GaAs contacts to n-GaAs we have obtained contact resistivity values ∼1×10-7 Ω cm2, and ∼1×10-8 Ω cm 2 for lateral contacts to a 10-nm-thick buried n+-GaAs layer. The contact resistances were substantially temperature independent from 77 to 300 K. Regrown contacts to a 2DEG structure exhibited a much higher and temperature-dependent contact resisitivity which could be accounted for (according to numerical simulation) by ∼5×1012 cm-2 traps at the AlGaAs/ regrown GaAs interface. Post-growth annealing of the regrown annealing of the regrown interface drastically reduced the value of contact resistivity for 2DEG structures to ∼2×10-8 Ω cm2.
P. Solomon
DRC 2001
T.F. Kuech, R.M. Potemski, et al.
Journal of Applied Physics
G.M. Cohen, C. Cabral Jr., et al.
MRS Proceedings 2002
C.C. Han, X.Z. Wang, et al.
Journal of Applied Physics