Microscopy and Microanalysis

Paper

26 Jul 2009

Precision, double XTEM sample preparation of site specific Si nanowires

Abstract

No abstract available.

Conference paper

Electromigration reliability of advanced interconnects

C.-K. Hu, L. Gignac, et al.

International Workshop on Stress-Induced Phenomena in Metallization 2007

Conference paper

Three-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomography

P.A. Ercius, D.A. Muller, et al.

M&M 2006

Paper

Imaging and analysis of subsurface Cu interconnects by detecting backscattered electrons in the scanning electron microscope

L. Gignac, M. Kawasaki, et al.

Journal of Applied Physics

Paper

Mechanisms for microstructure evolution in electroplated copper thin films near room temperature

J.M.E. Harper, C. Cabral Jr., et al.

Journal of Applied Physics

View all publications