Conference paperIn-situ study of Ti/TiN stability under nitrogen annealP. DeHaven, K.P. Rodbell, et al.MRS Spring Meeting 1999
PaperElectromigration in Cu(Al) and Cu(Mn) damascene linesC.-K. Hu, J. Ohm, et al.Journal of Applied Physics
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999