Conference paper
Soft x-ray diffraction of striated muscle
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
Recent studies show that plasma abatement is a practical alternative to thermal abatement devices for reducing fluorocarbon (FC) emissions from dielectric etch processes, with significantly lower CoO. Point-of-use (POU) plasma abatement devices attain high FC destruction and removal efficiency (DRE) with no process impacts and produce simple, low-molecular-weight, water-scrubble by-products.
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
C.M. Brown, L. Cristofolini, et al.
Chemistry of Materials
A. Gangulee, F.M. D'Heurle
Thin Solid Films