Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperKinetic model for the chemical vapor deposition of tungsten in the silane reduction processJulian J. HsiehJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
PaperCrystal structure and cation distribution of MnCrInS4 from synchrotron powder diffraction dataG. Will, N. Masciocchi, et al.Zeitschrift fur Kristallographie - New Crystal Structures
