H.D. Dulman, R.H. Pantell, et al.
Physical Review B
Paper
Nickel-alloyed tin-lead eutectic solder for surface mount technology
Abstract
No abstract available.
Related
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics
J. Tersoff
Applied Surface Science
Michiel Sprik
Journal of Physics Condensed Matter