Low-Resource Speech Recognition of 500-Word Vocabularies
Sabine Deligne, Ellen Eide, et al.
INTERSPEECH - Eurospeech 2001
Electrolytic plating is used to produce the interconnect wiring on the current generation of high-performance multichip modules used in IBM S/390® and AS/400® servers. This paper reviews the material and manufacturing requirements for successful implementation of a multilayer high-density wiring pattern involving electroplated copper metal and polyimide dielectric. Various strategies for the construction of thin-film structures (planarized and nonplanarized) are outlined, and the advantages of electrolytic plating over dry deposition techniques are described.
Sabine Deligne, Ellen Eide, et al.
INTERSPEECH - Eurospeech 2001
Sonia Cafieri, Jon Lee, et al.
Journal of Global Optimization
Qing Li, Zhigang Deng, et al.
IEEE T-MI
M.J. Slattery, Joan L. Mitchell
IBM J. Res. Dev