Conference paper
An optimal liner for copper damascene interconnects
D. Edelstein, C. Uzoh, et al.
ADMETA 2001
During a transient period following deposition, the microstructure of electroplated copper thin films evolve towards larger grain size, different preferred crystallographic texture, and less resistivity, hardness and compressive stress. A model to account for this observation is derived based on grain boundary energy in the fine-grained as-deposited films providing the underlying energy density driving abnormal grain growth. Model predictions describe the mechanisms for the evolution process.
D. Edelstein, C. Uzoh, et al.
ADMETA 2001
L. Clevenger, A. Mutscheller, et al.
Journal of Applied Physics
P. Solomon, K.W. Guarini, et al.
IEEE Circuits and Devices Magazine
S.-E. Hörnström, A. Charai, et al.
Surface and Interface Analysis