Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperHoles trapped near Mg2+ and Al3+ impurities in SrTiO3O.F. Schirmer, W. Berlinger, et al.Solid State Communications
PaperCurrent saturation in submicrometer graphene transistors with thin gate dielectric: Experiment, simulation, and theoryShu-Jen Han, Dharmendar Reddy, et al.ACS Nano
PaperStructural and magnetic properties of Cr and Mn doped InNA. Ney, R. Rajaram, et al.Journal of Magnetism and Magnetic Materials
