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Conference paperIntegration of polymer self-assembly for lithographic applicationJoy Y. Cheng, Daniel P. Sanders, et al.SPIE Advanced Lithography 2008
PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
PaperKinetic model for the chemical vapor deposition of tungsten in the silane reduction processJulian J. HsiehJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
