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SPIE Physics and Simulation of Optoelectronic Devices 1992
Si photonics for on- and off-chip communications in future multicore microprocessor chips is considered. Using 3D integration to combine an on-chip optical network plane with a separate microprocessor plane can significantly improve the performance/watt of multicore chips. © 2007 IEEE.
J.A. Kash, M. Zachau, et al.
SPIE Physics and Simulation of Optoelectronic Devices 1992
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