Compression for data archiving and backup revisited
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
The Si-Ge interdiffusivity in epitaxial strained Si/Si1-yGey/strained Si/relaxed Si1-x0Gex0 and strained Si/relaxed Si 1-x0Gex0 heterostructures is investigated for Ge fractions between 0 and 0.56 over the temperature range of 770-920 °C. Si-Ge interdiffusivity is found to increase by 2.2× for every 10% increase in local Ge fraction for interdiffusion in strained Si/relaxed SiGe structures. Significantly enhanced Si-Ge interdiffusion is observed in structures with Si1-yGey layers under biaxial compressive strain. The interdiffusivity increases by 4.4× for every 0.42% increase in the magnitude of biaxial compressive strain. These results were incorporated into an interdiffusion model that successfully predicts the interdiffusion in epitaxial SiGe heterostructures. © 2007 IOP Publishing Ltd.
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990
Lawrence Suchow, Norman R. Stemple
JES
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME