PaperCleavable epoxy resins: Design for disassembly of a thermosetStephen L. Buchwalter, Laura L. KosbarJ Polym Sci Part A
PaperDevelopment of conductive adhesive materials for via fill applicationsSung K. Kang, Stephen L. Buchwalter, et al.IEEE Transactions on Components and Packaging Technologies
PaperOrganic Chemistry on a Polyimide SurfaceRichard R. Thomas, Stephen L. Buchwalter, et al.Macromolecules
PaperThe Complementary Redox Properties of Viologens and Pyromellitimides: A New Class of Organic ConductorsStephen L. Buchwalter, Revathi Iyengar, et al.JACS