Flip-chip bonding with solder dipping

M.J. Brady; A. Davidson

doi:10.1063/1.1138505

Review of Scientific Instruments

Paper

01 Jan 1985

Flip-chip bonding with solder dipping

View publication

Abstract

We report a simple technique for making flip-chip contacts. The equipment required, in addition to a small-scale photoresist clean room, is a beaker of molten solder.

Paper

Extremely high frequency pulse magnetic resonance by picosecond magneto-optic sampling

M.R. Freeman, M.J. Brady, et al.

Applied Physics Letters

Paper

Numerical study of long Josephson junctions coupled to a high-Q cavity

N. Gronbech-Jensen, N.F. Pedersen, et al.

Physical Review B

Paper

An automated 55 GHz cryogenic Josephson sampling oscilloscope

P. Bodin, M.L. Jacobsen, et al.

Review of Scientific Instruments

Paper

Noise temperature contours for high-sensitivity Squids

A. Davidson

Applied Physics Letters

View all publications

Abstract

Related

Extremely high frequency pulse magnetic resonance by picosecond magneto-optic sampling

Numerical study of long Josephson junctions coupled to a high-Q cavity

An automated 55 GHz cryogenic Josephson sampling oscilloscope

Noise temperature contours for high-sensitivity Squids