Thomas Brunschwiler, Raúl Mroßko, et al.
ESTC 2016
Pumped two-phase cooling utilizing an interconnect-compatible dielectric fluid is an enabling technology to fully optimize the benefits of the improved integration density possible with three-dimensional (3D) stacking, but is faced with significant developmental challenges, including the need for high fidelity modeling. In the present work, a Eulerian multiphase model developed for predicting two-phase flow and heat transfer behavior in parallel micro-channels and micro-pin fields has been extended to radial expanding channels populated with micro-pins. The model was used to design the cooling channel structures in and to predict the thermal behavior of an embedded two-phase liquid cooled microprocessor module. A detailed model validation showed that this model can predict the chip junction temperature to within two degrees of the experimental data.
Thomas Brunschwiler, Raúl Mroßko, et al.
ESTC 2016
Mark D. Schultz, Pritish R. Parida, et al.
ITherm 2017
Pritish R. Parida, Timothy Chainer
SEMI-THERM 2021
Fanghao Yang, Mark D. Schultz, et al.
ITherm 2016