Dry etch challenges of 0.25 μm dual damascene structures

Sang-Min Park, Mark P. Stoykovich, et al.

Advanced Materials

S.E. Harnstrarn, D. Moy, et al.

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

J. Tersoff

Applied Surface Science

Lucy Vost, Vijil Vijil, et al.

NeurIPS 2024