PaperElectromigration in on-chip single/dual damascene Cu interconnectionsC.-K. Hu, L. Gignac, et al.JES
Conference paperCorrelation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnectsL. Gignac, C.-K. Hu, et al.Microelectronic Engineering
PaperAtom motion of Cu and Co in Cu damascene lines with a CoWP capC.-K. Hu, L. Gignac, et al.Applied Physics Letters
Conference paperImaging at high beam energies in the scanning electron microscopeL. Gignac, S.H. Boettcher, et al.M&M 2006
