Extendibility of Cu damascene to 0.1 μm wide interconnections
C.-K. Hu, K.Y. Lee, et al.
MRS Spring Meeting 1998
The electromigration in Cu bamboo-like grain structure lines with CoWP capping layer and the effect of Cu conductivity from diffusion of Co into Cu, were studied. Focused ion beam and scanning transmission electron microscopy were used to examine the Cu line microstructure and void formation. The Cu line was completely encased in metallic thin film layers, and the map was obtained by acquiring energy dispersive x-ray spectra. The extracted activation energies for Cu electromigration and Co diffusion in these samples were found to be comparable with bulk-like diffusion.
C.-K. Hu, K.Y. Lee, et al.
MRS Spring Meeting 1998
Peter Ercius, Lynne M. Gignac, et al.
Microscopy and Microanalysis
L. Gignac, C.-K. Hu, et al.
Microelectronic Engineering
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999