PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperInterface kinetics and crystal growth under conditions of constant cooling rate. I. Constant diffusion coefficientR. Ghez, J.S. LewJournal of Crystal Growth
