Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperSchottky contacts to cleaved GaAs (110) surfaces. I. Electrical properties and microscopic theoriesA.B. McLean, R.H. WilliamsJournal of Physics C: Solid State Physics
PaperScanning tunneling microscopy of individual molecules: Beyond imagingJ.K. Gimzewski, T.A. Jung, et al.Surface Science
