TEMPERATURE DEPENDENCE OF STRESSES IN Ti, Cr, AND Cu THIN FILMS.
C.-K. Hu, D. Gupta, et al.
VMIC 1984
A stretch deformation method has been developed for quantitative study of adhesion and deformation of metal/polymer structures. The adhesion energy is directly measured from the difference in the load versus elongation curves between film/substrate and substrate structures. This method has been applied to study structures formed with Cu, Cr, and Cu/Cr deposited on pyromellitic dianhydride-oxydianiline polyimide. The importance of crack formation in the metal layer for initiating interfacial delamination is demonstrated.
C.-K. Hu, D. Gupta, et al.
VMIC 1984
S.T. Chen, C.H. Yang, et al.
Journal of Applied Physics
F.K. LeGoues, B.D. Silverman, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
P.N. Sanda, J.W. Bartha, et al.
JVSTA