DSA via hole shrink for advanced node applications
Cheng Chi, Chi Chun Liu, et al.
SPIE Advanced Lithography 2016
New tools enable new ways of working, and materials science is no exception. In materials discovery, traditional manual, serial, and human-intensive work is being augmented by automated, parallel, and iterative processes driven by Artificial Intelligence (AI), simulation and experimental automation. In this perspective, we describe how these new capabilities enable the acceleration and enrichment of each stage of the discovery cycle. We show, using the example of the development of a novel chemically amplified photoresist, how these technologies’ impacts are amplified when they are used in concert with each other as powerful, heterogeneous workflows.
Cheng Chi, Chi Chun Liu, et al.
SPIE Advanced Lithography 2016
Wei Yuan Yang, Jed W. Pitera, et al.
Journal of Molecular Biology
Anna Paola Carrieri, Will P. M. Rowe, et al.
AAAI 2019
Laura-Jayne Gardiner, Anna Paola Carrieri, et al.
PLoS ONE