C.A. Micchelli, W.L. Miranker
Journal of the ACM
We present a LiNbO3 integrated photonic platform with wafer-scale bonding to a Si3N4 photonic circuit. The platform exhibits <0.1 dB/cm propagation loss and <2.5 dB/facet fiber-chip coupling loss. We demonstrate phase shifters, frequency-agile lasers, optical splitters, and other devices.
C.A. Micchelli, W.L. Miranker
Journal of the ACM
Saurabh Paul, Christos Boutsidis, et al.
JMLR
Joxan Jaffar
Journal of the ACM
Kenneth L. Clarkson, Elad Hazan, et al.
Journal of the ACM