IBM at SEMICON Japan 2025

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About

SEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions. The event will display the latest innovations and trends in the global semiconductor industry through a range of exhibitions, seminars, and forums. Key topics will include advancements across the design and manufacturing supply chain, emerging technologies such as quantum computing, photonics-electronics convergence, advanced packaging, as well as AI, gaming, robotics, mobility, aerospace, and medical applications.

Make sure to stop by the IBM Booth in the AIS hall!

Thought Leadership

Keynote

  • "Semiconductor Innovations for Sustainable GenAI and HPC Applications" by Mukesh Khare

IBM Sessions

  • "Co-Packaged Optics & Advanced Chiplet Packaging for AI" by John Knickerbocker
  • "Winning the Silicon Race: Three Strategies to Secure AI Advantage" by Noriko Suzuki
  • "The Sustainable Materials Revolution Driven by IBM Material DX" by Alessandro Curioni
  • "Chiplets Connecting the Future: Photonics, Mobility, and AI Shaping a Sustainable Society" with Shintaro Yamamichi on the panel

See details in the agenda section below.

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Speakers

AC
Alessandro Curioni

Alessandro Curioni

IBM Fellow, Vice President Europe and Africa and Director IBM Research Zurich
IBM Research

Agenda

  • Description:

    The increasing demands on compute for generative AI and high performance computing (HPC) are driving significant opportunities for semiconductor innovation. IBM’s logic roadmap has moved the industry forward with novel materials and architectures and is accelerating its progress in collaboration with a rich ecosystem of partners based in Albany, NY. This talk will highlight IBM’s innovation and ecosystem development for advanced semiconductors towards sustainable GenAI and HPC applications. 

    This keynote is part of the session "Next Generation Semiconductor Technology 1 ~Devices Semiconductor Revolution to Create the Future", find more information here.

    Speakers:
  • Description:

    Speaker: John Knickerbocker- IBM

    Co-packaged optics (CPO) technology and Advanced Chiplet Packaging for artificial intelligence (AI) systems are driving high bandwidth density optics, high energy efficiency and compatibility of electronics and optics solutions. Challenges in technology for AI systems are continuing to accelerate CPO and photonics technology integration to support performance, lower cost, lower losses, high yield, repeatability and resilience in system applications. Next generations of hardware require increased numbers of waveguides, energy efficient Electrical-Optical-Electrical links also with high yield and reliability. This presentation will present updates on technology demonstrations and discuss next elements toward future CPO PDK and ADK for AI systems scaling.

    This presentation is part of the following session: APCS Technology Session Ⅲ Photonic-Electronic Integration How to Win in the Era of Photonic-Electronic Integration

  • Description:

    Speaker: Noriko Suzuki- IBM

    As companies step up efforts to capture AI-powered business opportunities, big ambitions are riding on cutting-edge, nanoscale semiconductors. But as global production and resource bottlenecks persist, there aren’t enough advanced AI chips to go around. How is this chip shortage impacting buyers and suppliers? A new report from the IBM Institute for Business Value, in partnership with SEMI, indicates that an already constrained AI semiconductor market is about to get even tighter.

    This presentation is part of the following session: Innovating Semiconductor Infrastructure for the Future of AI Toward Scalable and Sustainable AI

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