Project Name

Electrical Interconnect and Packaging

Our mission is to provide innovative interconnect and packaging solutions for supercomputers, servers and client machines. We develop advanced interconnect and packaging technologies for heterogeneous 2.5D/3D system integration, VCSEL-based optoelectronic network, silicon photonics and wireless communication. We provide best-of-breed electrical design and simulation tools, develop new characterization techniques, and implement leading-edge thermal and mechanical solutions for IBM systems. In addition, we use new architectural concepts in designing and building prototype systems to explore peak supercomputer performance. We also support supercomputing on existing high-end IBM machines.