Xiaoyan Shao  Xiaoyan  Shao photo       

contact information

Research Staff Member
Thomas J. Watson Research Center, Yorktown Heights, NY USA
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Professional Associations

Professional Associations:  Electrochemical Society (ECS)  |  INFORMS


Klein, L. J., et al. (2015). PAIRS: A scalable geo-spatial data analytics platform. Big Data (Big Data), 2015 IEEE International Conference on Big Data: 1290-1298.

den Heijer, M., et al. (2014). "Patterned electrochemical deposition of copper using an electron beam." Apl Materials 2(2).
    
Haight, R., et al. (2014). "Electronic and elemental properties of the Cu2ZnSn(S,Se)(4) surface and grain boundaries." Applied Physics Letters 104(3).
    
Shao, I. and L. Gignac (2012). Mechanism Study of Ag Catalyzed Directional Etch of Silicon for Nanowire Formation. Semiconductors, Metal Oxides, and Composites: Metallization and Electrodeposition of Thin Films and Nanostructures 2. P. M. Vereecken, G. Oskam, I. Shao and J. Fransaer. 41: 9-25.

Harrer, S., et al. (2010). "Electrochemical Characterization of Thin Film Electrodes Toward Developing a DNA Transistor." Langmuir 26(24): 19191-19198.
    
Shao, I., et al. (2010). "Stress in electrodeposited CoFe alloy films." Journal of Crystal Growth 312(8): 1262-1266.
    
Shao, I., et al. (2010). Stress in Electrodeposited High Moment CoFe Films. Fundamentals of Electrochemical Growth: From Upd to Microstructures - Symposium in Memory of Prof. Evgeni Budevski. S. R. Brankovic, G. Zangari and N. Vasiljevic. 25: 35-43.
    
Stellari, F., et al. (2010). "Photovoltaic (PV) cells characterization using advanced optical tools." 2010 International Reliability Physics Symposium: 508-515.

Venkatasamy, V., et al. (2008). "ALD approach toward electrodeposition of Sb(2)Te(3) for phase-change memory applications." Journal of the Electrochemical Society 155(11): D693-D698.

Pan, J., et al. (2007). "Novel approach to reduce source/drain series and contact resistance in high-performance UTSOI CMOS devices using selective electrodeless CoWP or CoB process." IEEE Electron Device Letters 28(8): 691-693.

Shao, I., et al. (2007). "Deposition and characterization of Fe0.55Co0.45 nanowires." Journal of the Electrochemical Society 154(11): D572-D576.
    
Shao, I., et al. (2007). An alternative low resistance MOL technology with electroplated rhodium as contact plugs for 32nm CMOS and beyond, Proceedings of the IEEE 2007 International Interconnect Technology Conference: 102-104.
    
Pan, J., et al. (2006). Novel approach to reduce source/drain series resistance in high performance CMOS devices using self-aligned CoWP process for 45nm node UTSOI transistors with 20nm gate length, 2006 Symposium on VLSI Technology.
    
West, A. C., et al. (2005). "Numerical simulation of electrochemical planarization of copper overburden." Journal of the Electrochemical Society 152(10): C652-C656.
    
Shao, I., et al. (2003). Electrodeposition of FeCo nanowires, Magnetic Materials, Processes, and Devices Vii and Electrodeposition of Alloys, Proceedings, Editor: Krongelb, S., et. al.

    
Shao, I., et al. (2003). "Electrochemical deposition of FeCo and FeCoV alloys." Journal of the Electrochemical Society 150(3): C184-C188.
    
Shao, I., et al. (2002). "Synthesis and characterization of particle-reinforced Ni/Al2O3 nanoconiposites." Journal of Materials Research 17(6): 1412-1418.

Shao, I., et al. (2002). "Kinetics of particle codeposition of nanocomposites." Journal of the Electrochemical Society 149(11): C610-C614.
    
Shao, I., et al. (2001). Electrochemical deposition of FeCo alloys and FeCo/TiO2 nanocomposites, Proceeding on Applications of Ferromagnetic and Optical Materials, Storage and Magnetoelectronics, Editor: Borg, H. J., et al.

    
Vereecken, P. M., et al. (2000). "Particle codeposition in nanocomposite films." Journal of the Electrochemical Society 147(7): 2572-2575.
    
Josell, D., et al. (1999). "Measuring the interface stress: Silver/nickel interfaces." Journal of Materials Research 14(11): 4358-4365.
   




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