Qinghuang Lin  Qinghuang Lin photo       

contact information

Research Staff Member, Project Manager and IBM Master Inventor
Thomas J. Watson Research Center, Yorktown Heights, NY USA
  +1dash914dash945dash2366

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Short Courses

o "Lithography Integration for Semiconductor Front-End-Of-Line (FEOL) and Back-End-Of-Line (BEOL)," with Ying Zhang, SPIE Advanced Lithography Symposium, 2015, San Jose, CA, Feb., 2015

o "Lithography Integration for Semiconductor Front-End-Of-Line (FEOL) and Back-End-Of-Line (BEOL)," with Ying Zhang, SPIE Advanced Lithography Symposium, 2014, San Jose, CA, Feb., 2014

o "Lithography Integration for Semiconductor Front-End-Of-Line (FEOL) and Back-End-Of-Line (BEOL)," with Ying Zhang, SPIE Advanced Lithography Symposium, 2013, San Jose, CA, Feb., 2013

o "Lithography Integration for Semiconductor Front-End-Of-Line (FEOL) and Back-End-Of-Line (BEOL)," with Ying Zhang, SPIE Advanced Lithography Symposium, 2012, San Jose, CA, Feb., 2012

o "Lithography Integration for Semiconductor Front-End-Of-Line (FEOL) and Back-End-Of-Line (BEOL)," with Ying Zhang, SPIE Advanced Lithography Symposium, 2011, San Jose, CA, Feb., 2011

o "Lithography Integration for Semiconductor Front-End-Of-Line (FEOL) and Back-End-Of-Line (BEOL)," with Ying Zhang, SPIE Advanced Lithography Symposium, 2010, San Jose, CA, Feb., 2010

o "Lithography Integration for Semiconductor Back-End-Of-Line (BEOL)," SPIE Advanced Lithography Symposium, 2009, San Jose, CA, Feb., 2009

o "Lithography Integration for Semiconductor Back-End-Of-Line (BEOL)," SPIE Advanced Lithography Symposium, 2008, San Jose, CA, Feb., 2008

o "Lithography Integration for Semiconductor Back-End-Of-Line (BEOL)," SPIE Advanced Lithography Symposium, 2007, San Jose, CA, Feb.- March, 2007

 


Invited Talks

o  “Nanofabrication for Detecting and Controlling Single Biopolymers,” ACS National Meeting, Boston, MA, August, 2015

o  “Biosensors and Healthcare,” 2015 Beyond Computing Symposium, Shanghai, China, March, 2015

o  “200 mm Wafer-Scale Integration of Sub-20 nm Nanofluidic Chips for Detecting and Controlling Single DNA Molecules,” CSTIC 2015, Shanghai, China, March, 2015

o  “Nanofabrication for Detection and Manipulation of Single DNA Molecules,” New York University, New York City, NY, November, 2014 

o “Smarter Integration for Green IC Manufacturing,” Global Summit for Advanced manufacturing (GSAM), San Francisco, CA, July, 2014

o “Multi-functional Materials for Green Nanoelectronic Manufacturing,” NanotechConnect, Washington DC, May, 2014

o “Photo-Patternable Low-κ Dielectrics for “Greener” Semiconductor Manufacturing,” University of California, Irvine, California, February, 2013

o “Photo-patternable Low-K Dielectric Materials for Green Nanoelectronic Manufacturing,” Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hong Kong, China, April, 2012

o “Functional Inorganic Polymers for Green Nanoelectronic Manufacturing,” Institute of Chemistry, Chinese Academy of Sciences, Beijing, China, April, 2012

o “Functional Inorganic Polymers for Green Nanoelectronic Manufacturing,” ACS/CCS Joint Symposium on Advances in Polymer Science and Engineering, Chinese Chemical Society Congress, Chengdu, China, April, 2012

o “Transforming Si Polymers into Patternable Permanent Dielectric Insulators for Advanced Computer Chips by Ultraviolet Curing,” ACS National Meeting, San Diego, CA, March, 2012

o “Lithography Innovation for Advanced Semiconductor Manufacturing,” Beijing International Microelectronics Symposium (BIMS), Beijing, China, November, 2011

o “Multi-functional Materials for “Greener” Semiconductor Manufacturing,” Tsinghua University, Beijing, China, April, 2011

o “Multi-functional Materials for “Greener” Semiconductor Manufacturing,” Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China, April, 2011

o “Photo-Patternable Low-κ Dielectrics for “Greener” Semiconductor Manufacturing,” University of Wisconsin, Madison, Wisconsin, April, 2011

o “Functional Inorganic Polymers for “Greener” Semiconductor Manufacturing,” ACS National Meeting, Anaheim, CA, March, 2011

o "New Paradigms in Sub-45nm Node Semiconductor Manufacturing: Challenges and Opportunities," BIMS 2010, Beijing, China, November, 2010

o "Photo-Patternable Low-k Dielectric Materials," ICSICT 2010, Shanghai, China, November, 2010

o "Photo-patternable Low Dielectric Constant Materials: Permanent On-Chip Dielectrics for "Greener" Semiconductor Manufacturing," Cornell Ski-Hut Seminar, Niagara Falls, NY, June, 2010

o "Integration of Photo-Patternable Low-k Dielectrics into Advanced Cu BEOL," ADMETA 2009, Tokyo, Japan, October, 2009

o "Photo-Patternable Low-k Dielectrics: New Materials for "Greener" Semiconductor Manufacturing," MRS Spring Meeting, San Francisco, CA, April, 2009

o "Integration of Nanoporous Low-k Materials for Advanced Cu Interconnects: Challenges and Opportunities," National Institute of Standard and Technology, Gaithersburg, MD, March, 2008

o "Integration of Nanoporous Low-k Materials for Advanced Cu Interconnects: Challenges and Opportunities," Brewer Science Lithography Symposium, Albany, NY, Oct., 2007

o "Challenges and Opportunities in the Integration of Nanoporous Low-k Materials for Advanced Cu/Low-k Interconnects," 6th International Semiconductor Technology Conference, Shanghai, China, March, 2007

o "Photo-Patternable Low-k Dielectrics," IBM Almaden Research Center, San Jose, CA, March, 2007

o "Polymers for Microelectronics and Nanoelectronics," Fudan University, Shanghai, China, March, 2007

o "Advanced Materials in Microelectronics and Nanoelectronics," Tsinghua University, Beijing China, July, 2006

o "Advanced Low-K Dielectrics for Microelectronics: Exploring the Nanocomposite Approach," Polymer Nanocomposite Conference, Lehigh University, PA, March, 2006

o "Polymers in Microelectronics and Nanoelectronics," ACS Fall National Meetings, Washington DC, August, 2005

o "Integrating Nanoporous Low Dielectric Constant Materials in sub-100nm Computer Chips," ACS Spring National Meetings, Anaheim, CA, April, 2004

o "Materials Issues in High-Resolution Lithography," Silicon Innovation Seminar, IBM T. J. Watson Research Center, Yorktown Heights, NY, June 2000

o "Extension of Optical Lithography: A Thin Film Imaging Approach," Cornell University, Ithaca, NY, Polymer Outreach Program, May, 2000

o "Extension of Optical Lithography: A Thin Film Imaging Approach," National Institute of Standard and Technology, Gaithersburg, MD, February, 2000

o "Nanometer Scale Resist Line Edge Roughness," Cornell University, Ithaca, NY, January, 2000

o "248nm Bilayer Resist Materials and Processes," IBM/Simens DRAM Development Alliance, Fishkill, NY, 1999

o "IBM's 248nm Bilayer Resist Technology," Shipley Company, Marlborough, MA, October, 1999

o "New Materials for an Old Wavelength: Bilayer Resist for Extension of 248nm Optical Lithography," University of Texas at Austin, May, 1999

o "Extension of 248nm optical lithography: A Thin Film Imaging Approach," Silicon Innovation Seminar, IBM T. J. Watson Research Center, Yorktown Heights, NY, June 1999

o "New Photopolymers," Cornell University, Ithaca, NY, January, 1999