Bruno Michel  Bruno Michel photo       

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Advanced Micro Integration
Zurich Research Laboratory, Zurich, Switzerland
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Professional Associations:  National Academy of Engineering

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More information:  Toward zero-emission data centers through direct reuse of thermal energy


2016

Significant heat transfer enhancement in microchannels with herringbone-inspired microstructures
Julian Marschewski, Raphael Brechbuehler, Stefan Jung, Patrick Ruch, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer95, 755-764, 2016

Combined influence of pore size distribution and surface hydrophilicity on the water adsorption characteristics of micro- and mesoporous silica
Sarmenio Saliba, Patrick Ruch, Willi Volksen, Teddie P. Magbitang, Geraud Dubois, Bruno Michel
Microporous and Mesoporous Materials, 221-228, 2016

Monolithic nitrogen-doped carbon as a water sorbent for high-performance adsorption cooling
Lukas Huber, Patrick Ruch, Roland Hauert, Gesine Saucke, Santhosh Kumar Matam, Bruno Michel, Matthias M. Koebel
RSC Advances6, 25267-25278, 2016


2015

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle and Kenneth E. Goodson
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels

From Cooling Integrated Circuits to Efficient Electrical Power Generation
S. Paredes, B. Burg, P. Ruch, I. Meijer, B. Michel
ERCIM News101, 49-50, 2015

Thermo-Economic Analysis of a Trigeneration HCPVT Power Plant
A. Selviaridis, B. Burg, A.S. Wallerand, F. Marechal, B. Michel
11th Int'l Conf. on Concentrator Photovoltaic Systems (CPV-11) , 2015

Combined power delivery and cooling for high density, high efficiency microservers
M. Cossale, S. Paredes, R. P. Luijten, B. Michel
IEEE 2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), , pp. 1-6

A high-efficiency hybrid high-concentration photovoltaic system
Severin Zimmermann, Henning Helmers, Manish K. Tiwari, Stephan Paredes, Bruno Michel, Maike Wiesenfarth, Andreas W. Bett, Dimos Poulikakos
International Journal of Heat and Mass Transfer89, 514-521, 2015

Combined influence of pore size distribution and surface hydrophilicity on the water adsorption characteristics of micro- and mesoporous silica
Sarmenio Saliba, Patrick Ruch, Willi Volksen, Teddie P. Magbitang, Geraud Dubois, Bruno Michel
Microporous and Mesoporous Materials226, 221-228, 2015

A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: an experimental study
Chander Shekhar Sharma, Gerd Schlottig, Thomas Brunschwiler, Manish K. Tiwari, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer88, 684-694, 2015

Energy efficient hotspot-targeted embedded liquid cooling of electronics
Chander Shekhar Sharma, Manish K. Tiwaria, Severin Zimmermann, Thomas Brunschwiler, Gerd Schlottig, Bruno Michel, Dimos Poulikakos
Applied Energy138, 414-422, 2015

Mixing with herringbone-inspired microstructures: overcoming the diffusion limit in co-laminar microfluidic devices
Julian Marschewski, Stefan Jung, Patrick Ruch, Nishant Prasad, Sergio Mazzotti, Bruno Michel, Dimos Poulikakos
Lab On A Chip 15(8), 1923-1933, 2015

Receiver-module-integrated thermal management of high-concentration photovoltaic thermal systems
Stephan Paredes, Brian R. Burg, Patrick Ruch, Emanuel Loertscher, Fabio Malnati, Marco Cucinelli, Donato Bonafrate, Andre Mocker, Andre Bernard, Gianluca Ambrosetti, Andrea Pedretti, Bruno Michel
IEEE 42nd Photovoltaic Specialist Conference (PVSC), 2015


2014

Integrated microfluidic power generation and cooling for bright silicon MPSoCs
Mohamed M. Sabry, Arvind Sridhar, David Atienza, Patrick Ruch, Bruno Michel
IEEE Design, Automation and Test in Europe Conference and Exhibition (DATE), pp. 1-6, 2014

PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs
Arvind Sridhar, Mohamed M Sabry, Patrick Ruch, David Atienza, Bruno Michel
2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 527-534

Heat-driven adsorption chiller systems for sustainable cooling applications
Patrick Ruch, Sarmenio Saliba, Chin Lee Ong, Yazid Al-Shehri, Abdalrahman Al-Rihaili, Ahmed Al-Mogbel, Bruno Michel
11th International Energy Agency Heat Pump Conference, 2014

Integrated microfluidic power generation and cooling for bright silicon MPSoCs
Mohamed M. Sabry, Arvind Sridhar, David Atienza, Patrick Ruch, Bruno Michel
Design, Automation and Test in Europe Conference and Exhibition (DATE), pp. 1-6, IEEE, 2014

Dynamic flow control and performance comparison of different concepts of two-phase on-chip cooling cycles
Jackson Braz Marcinichen, Duan Wu, Stephan Paredes, John R Thome, Bruno Michel
Applied Energy114, 179--191, Elsevier, 2014

Modeling of Two-Phase Evaporative Heat Transfer in Three-Dimensional Multicavity High Performance Microprocessor Chip Stacks
Yassir Madhour, Brian P d'Entremont, Jackson Braz Marcinichen, Bruno Michel, John Richard Thome
Journal of Electronic Packaging 136(2), 021006, American Society of Mechanical Engineers, 2014

Exergoeconomic analysis of high concentration photovoltaic thermal co-generation system for space cooling
Veronica Garcia-Heller, Stephan Paredes, Chin Lee Ong, Patrick Ruch, Bruno Michel
Renewable and Sustainable Energy Reviews34, 8-19, Elsevier, 2014

Ecological and economical advantages of efficient solar systems
B.R. Burg, A. Selviaridis, S. Paredes, B. Michel
AIP Conf. Proc., 2014


2013

Thermofluidics and energetics of a manifold microchannel heat sink for electronics with recovered hot water as working fluid
Chander Shekhar Sharma, Manish K Tiwari, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer 58(1), 135-151, Elsevier, 2013

An experimentally optimized model for heat and mass transfer in direct contact membrane distillation
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International Journal of Heat and Mass Transfer66, 855-867, Elsevier, 2013

The Potential of Solar Adsorption Air-Conditioning in Saudi Arabia: A Simulation Study
Ahmed Al-Mogbel, Patrick Ruch, Abdulrahman Al-Rihaili, Saleh Al-Ajlan, Paul Gantenbein, Andreas Witzig, Bruno Michel
Solar Cooling, 2013

Computational modeling of vortex shedding in water cooling of 3D integrated electronics
Fabio Alfieri, Manish K Tiwari, Adrian Renfer, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Fluid Flow44, 745-755, Elsevier, 2013


Integration of intra chip stack fluidic cooling using thin-layer solder bonding
Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel
3D Systems Integration Conference (3DIC), 2013 IEEE International, pp. 1--8

Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
Adrian Renfer, Manish K Tiwari, Rashmita Tiwari, Fabio Alfieri, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer65, 33-43, Elsevier, 2013

Roadmap towards ultimately-efficient zeta-scale datacenters
P. Ruch, T. Brunschwiler, S. Paredes, G. I. Meijer, B. Michel
Conference on Design, Automation and Test in Europe, pp. 1339--1344, 2013

Advanced liquid cooling in HCPVT systems to achieve higher energy efficiencies
S Zimmermann, H Helmers, MK Tiwari, W Escher, S Paredes, P Neves, D Poulikakos, M Wiesenfarth, AW Bett, B Michel
9th Int'l Conf. on Concentrator Photovoltaic Systems CPV-9, pp. 248-251, 2013

Vortex shedding from confined micropin arrays
Adrian Renfer, Manish K Tiwari, Ferdinand Meyer, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
Microfluidics and Nanofluidics 15(2), 231-242, Springer, 2013


2012


Hot water cooled electronics for high exergetic utility
S. Zimmermann, M. K. Tiwari, G. I. Meijer, B. Michel, D. Poulikakos
International Heat Transfer Conference, pp. 373--380, 2012

Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 574--587

Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
Yassir Madhour, Thomas Brunschwiler, Mario El Kazzi, John Richard Thome, Bruno Michel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp. 68--73

A multivariate parameter analysis of copper pillars eases the design of denser interconnects
Gerd Schlottig, Thomas Brunschwiler, Javier Goicochea, Werner Escher, Bruno Michel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on, pp. 1--6

Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
M. K. Tiwari, S. Zimmermann, C. S. Sharma, F. Alfieri, A. Renfer, T. Brunschwiler, G. I. Meijer, B. Michel, D. Poulikakos
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 545--551, 2012

Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility
S. Zimmermann, M. K. Tiwari, G. I. Meijer, S. Paredes, B. Michel, D. Poulikakos
International Journal of Heat and Mass Transfer 55, 6391, 2012

Optimal thermal operation of liquid-cooled electronic chips
Chander Shekhar Sharma, Severin Zimmermann, Manish K Tiwari, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer 55(7), 1957-1969, Elsevier, 2012

Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
Javier V Goicochea, Thomas Brunschwiler, Jonas Zuercher, Heiko Wolf, Keiji Matsumoto, Bruno Michel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 1234--1241

On the significance of developing boundary layers in integrated water cooled 3D chip stacks
Fabio Alfieri, Manish K Tiwari, Igor Zinovik, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer 55(19), 5222--5232, Elsevier, 2012

Thermal management and overall performance of a high concentration PV
Werner Escher, Stephan Paredes, Severin Zimmermann, Chin Lee Ong, Patrick Ruch, Bruno Michel
8th Int'l Conf on Concentrating Photovoltaic Systems CPV-8, pp. 239-243, 2012

Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications
Jonas Zuercher, Javier V Goicochea, Keiji Matsumoto, Bruno Michel, Thomas Brunschwiler
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-6

Aquasar: A hot water cooled data center with direct energy reuse
S. Zimmermann, G. I. Meijer, M. K. Tiwari, S. Paredes, B. Michel, D. Poulikakos
Energy 43, 237, 2012



2011

Flow boiling of R134a in a multi-microchannel heat sink with hotspot heaters for energy-efficient microelectronic CPU cooling applications
Yassir Madhour, Jonathan Olivier, Etienne Costa-Patry, Stephan Paredes, Bruno Michel, John Richard Thome
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1(6), 873--883, IEEE, 2011

Two-phase flow of refrigerants in 85-μm-wide multi-microchannels: Part I. Pressure drop
Etienne Costa-Patry, Jonathan Olivier, Bogdan Alexandru Nichita, Bruno Michel, John Richard Thome
International Journal of Heat and Fluid Flow 32(2), 451-463, Elsevier, 2011

Impact of electron-phonon transport on the thermal resistance of metal-nonmetal interfaces
Javier V Goicochea, Bruno Michel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, pp. 155--160

Cooling of next generation computer chips: Parametric study for single-and two-phase cooling
Y Madhour, S Zimmermann, J Olivier, J Thome, Bruno Michel, D Poulikakos
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on, pp. 1--7

Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, pp. 116--124

Compact thermal model for the transient temperature prediction of a water-cooled microchip module in low carbon emission computing
A Kubilay, S Zimmermann, I Zinovik, B Michel, D Poulikakos
Numerical Heat Transfer, Part A: Applications 59(11), 815--835, Taylor \& Francis, 2011

Ultra-High-Concentration Photovoltaic-Thermal Systems Based on Microfluidic Chip-Coolers
M. Müller, W. Escher, R. Ghannam, J. Goicochea, B. Michel, C.L. Ong, S. Paredes, F. Dimroth, S. Kurtz, G. Sala,
AIP Conference Proceedings-American Institute of Physics, pp. 231, 2011

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling
Mohamed M Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, Sylwia Szczukiewicz, Navid Borhani, John Richard Thome, Thomas Brunschwiler, Bruno Michel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011, pp. 1-6

Two-phase flow of refrigerants in 85-μm-wide multi-microchannels: Part II. Heat transfer with 35 local heaters
Etienne Costa-Patry, Jonathan Olivier, Bruno Michel, John Richard Thome
International Journal of Heat and Fluid Flow 32(2), 464-476, Elsevier, 2011

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics
Adrian Renfer, Manish K Tiwari, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
Experiments in fluids 51(3), 731--741, Springer, 2011

On the cooling of electronics with nanofluids
W Escher, T Brunschwiler, N Shalkevich, A Shalkevich, T Burgi, B Michel, D Poulikakos
Journal of heat transfer 133(5), 051401, American Society of Mechanical Engineers, 2011

Surface functionalization mechanisms of enhancing heat transfer at solid-liquid interfaces
Javier V Goicochea, Ming Hu, Bruno Michel, Dimos Poulikakos
Journal of Heat Transfer 133(8), 082401, American Society of Mechanical Engineers, 2011

Toward five-dimensional scaling: How density improves efficiency in future computers
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55(5), 15:1--13, IBM, 2011


2010

Zero-emission datacenters and 3D chip stacking
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Conference on Thermal Issues in Emerging Technologies Theory and Applications, pp. 3--3, 2010

Two-phase flow boiling of R134a in a multi-microchannel heat sink for microprocessor cooling
Yassir Madhour, Jonathan Olivier, Etienne Costa-Patry, Stephan Paredes, Bruno Michel, JR Thome
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, pp. 1--6

Advanced liquid cooling for concentrated photovoltaic electro-thermal co-generation
Werner Escher, Rami Ghannam, Ahmed Khalil, Stephan Paredes, Bruno Michel
Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on, pp. 9--17

Hot water cooled heat sinks for efficient data center cooling: towards electronic cooling with high exergetic utility
Peter Kasten, Severin Zimmermann, Manish Tiwari, Bruno Michel, Dimos Poulikakos
Frontiers in Heat and Mass Transfer (FHMT) 1(2), 2010

Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
R Wälchli, T Brunschwiler, B Michel, D Poulikakos
International Journal of Heat and Mass Transfer 53(5), 1004-1014, Elsevier, 2010

Phonon relaxation times of germanium determined by molecular dynamics at 1000 K
Javier V Goicochea, Bruno Michel
Semiconductor Thermal Measurement and Management Symposium, 2010. SEMI-THERM 2010. 26th Annual IEEE, pp. 278--282

Cooling of microprocessors with micro-evaporation: A novel two-phase cooling cycle
Jackson Braz Marcinichen, John Richard Thome, Bruno Michel
International Journal of Refrigeration 33(7), 1264--1276, Elsevier, 2010

Heat-removal performance scaling of interlayer cooled chip stacks
T. Brunschwiler, S. Paredes, U. Drechsler, B. Michel, W. Cesar, Y. Leblebici, B. Wunderle, H. Reichl
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1, 2010

Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips
W Escher, T Brunschwiler, B Michel, D Poulikakos
Journal of Heat Transfer 132(8), 081402, American Society of Mechanical Engineers, 2010

Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics
R Wälchli, T Brunschwiler, B Michel, D Poulikakos
Journal of Heat Transfer 132(5), 051401, American Society of Mechanical Engineers, 2010

A novel high performance, ultra thin heat sink for electronics
W Escher, B Michel, D Poulikakos
International Journal of Heat and Fluid Flow 31(4), 586--598, Elsevier, 2010

Direct waste heat utilization from liquid-cooled supercomputers
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Heat Transfer Conference, pp. 429--440, 2010

Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Ayse Kivilcim Coskun, David Atienza, Tajana Simunic Rosing, Thomas Brunschwiler, Bruno Michel
Design, Automation & Test in Europe Conference & Exhibition, pp. 111-116, 2010

3D integrated water cooling of a composite multilayer stack of chips
Fabio Alfieri, Manish K Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Journal of Heat Transfer 132(12), 121402, American Society of Mechanical Engineers, 2010

On the Thermal Conductivity of Gold Nanoparticle Colloids
N Shalkevich, W Escher, T Bürgi, B Michel, L Si-Ahmed, D Poulikakos
Langmuir 26(2), 663-670, American Chemical Society, 2010


2009

Validation of the Porous-medium Approach to Model Interlayer-cooled 3D-chip Stacks
Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W Cesar, G Toral, Yuksel Temiz, Yusuf Leblebici
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, pp. 1--10


Hotspot-adapted cold plates to maximize system efficiency
Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, B Michel, Evan Colgan, Pepe Bezama
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, pp. 150--156

Water nanoconfinement induced thermal enhancement at hydrophilic quartz interfaces
Ming Hu, Javier V Goicochea, Bruno Michel, Dimos Poulikakos
Nano letters 10(1), 279--285, ACS Publications, 2009

A benchmark study on the thermal conductivity of nanofluids
Jacopo Buongiorno, David C Venerus, Naveen Prabhat, Thomas McKrell, Jessica Townsend, Rebecca Christianson, Yuriy V Tolmachev, Pawel Keblinski, Lin-wen Hu, Jorge L Alvarado, others
Journal of Applied Physics 106(9), 094312, AIP Publishing, 2009

Toward zero-emission data centers through direct reuse of thermal energy
Thomas Brunschwiler, Brian Smith, E Ruetsche, Bruno Michel
IBM Journal of Research and Development 53(3), 11, IBM, 2009

Hydrogen-bond enhanced thermal energy transport at functionalized, hydrophobic and hydrophilic silica-water interfaces
P.A.E. Schoen, B. Michel, A. Curioni, D. Poulikakos
Chemical Physics Letters 476(4), 271-276, Elsevier, 2009

Efficiency of optimized bifurcating tree-like and parallel microchannel networks in the cooling of electronics
W Escher, B Michel, D Poulikakos
International Journal of Heat and Mass Transfer 52(5-6), 1421--1430, Elsevier, 2009

Interlayer cooling potential in vertically integrated packages
T. Brunschwiler, B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl
Microsystem Technologies 15(1), 57-74, Springer, 2009



2008

Radially oscillating flow hybrid cooling system for low profile electronics applications
R Walchli, R Linderman, T Brunschwiler, U Kloter, H Rothuizen, N Bieri, D Poulikakos, B Michel
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE, pp. 142--148

Thermal management of vertically integrated packages
Thomas Brunschwiler, Bruno Michel
Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, 635--649, Wiley Online Library, 2008

High heat flux two-phase cooling in silicon multimicrochannels
Bruno Agostini, John Richard Thome, Matteo Fabbri, Bruno Michel
Components and Packaging Technologies, IEEE Transactions on 31(3), 691--701, IEEE, 2008

Design of thermal interfaces with embedded microchannels to control bond line formation
Brian Smith, Hugo Rothuizen, Ryan Linderman, Thomas Brunschwiler, Bruno Michel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, pp. 410--418

Forced convective interlayer cooling in vertically integrated packages
Thomas Brunschwiler, B Michel, Hugo Rothuizen, U Kloter, B Wunderle, H Oppermann, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, pp. 1114--1125

Recent progress of thermal interface material research-an overview
Johan Liu, Bruno Michel, Marta Rencz, Christian Tantolin, Claude Sarno, Ralf Miessner, K-V Schuett, Xinhe Tang, Sebastien Demoustier, Afshin Ziaei
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on, pp. 156--162

High heat flux flow boiling in silicon multi-microchannels--Part I: heat transfer characteristics of refrigerant R236fa
Bruno Agostini, John Richard Thome, Matteo Fabbri, Bruno Michel, Daniele Calmi, Urs Kloter
International Journal of Heat and Mass Transfer 51(21), 5400--5414, Elsevier, 2008

High heat flux flow boiling in silicon multi-microchannels--Part III: Saturated critical heat flux of R236fa and two-phase pressure drops
Bruno Agostini, R\'emi Revellin, John Richard Thome, Matteo Fabbri, Bruno Michel, Daniele Calmi, Urs Kloter
International Journal of Heat and Mass Transfer 51(21), 5426--5442, Elsevier, 2008

High heat flux flow boiling in silicon multi-microchannels--Part II: Heat transfer characteristics of refrigerant R245fa
Bruno Agostini, John Richard Thome, Matteo Fabbri, Bruno Michel, Daniele Calmi, Urs Kloter
International Journal of Heat and Mass Transfer 51(21), 5415--5425, Elsevier, 2008


2007

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
T. Brunschwiler, U. Kloter, R.J. Linderman, H. Rothuizen, B. Michel
Components and Packaging Technologies, IEEE Transactions on 30(2), 226--234, IEEE, 2007

High-performance thermal interface technology overview
R Linderman, T Brunschwiler, B Smith, B Michel
Thermal Investigation of ICs and Systems, 2007, pp. 129--134

Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
RJ Linderman, T Brunschwiler, U Kloter, H Toy, B Michel
Semiconductor Thermal Measurement and Management Symposium, 2007, pp. 87--94

Utility of transient testing to characterize thermal interface materials
B Smith, T Brunschwiler, B Michel
Thermal Investigation of ICs and Systems, 2007, pp. 6--11

State of the art of high heat flux cooling technologies
B Agostini, M Fabbri, J Park, L Wojtan, J Thome, B Michel
Heat transfer engineering 28(4), 258--281, Taylor and Francis Ltd, 2007


2006

Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture
Thomas Brunschwiler, Hugo Rothuizen, Matteo Fabbri, Urs Kloter, Bruno Michel, RJ Bezama, Govindarajan Natarajan
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM'06. The Tenth Intersociety Conference on, pp. 196--203

Microchip cooling module based on FC72 slot jet arrays without cross-flow
M. Fabbri, A. Wetter, B. Mayer, T. Brunschwiler, B. Michel, H. Rothuizen, R. Linderman, U. Kloter
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE, pp. 54--58


2005

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]
T. Brunschwiler, U. Kloter, R. Linderman, H. Rothuizen, B. Michel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE, pp. 31--38

Diffusion of alkanethiols in PDMS and its implications on microcontact printing (μcp)
T.E. Balmer, H. Schmid, R. Stutz, E. Delamarche, B. Michel, N.D. Spencer, H. Wolf
Langmuir 21(2), 622-632, ACS Publications, 2005


2004

High-sensitivity miniaturized immunoassays for tumor necrosis factor α using microfluidic systems
Sandro Cesaro-Tadic, Gregor Dernick, David Juncker, Gerrit Buurman, Harald Kropshofer, Bruno Michel, Christof Fattinger, Emmanuel Delamarche
Lab on a Chip 4(6), 563-569, Royal Society of Chemistry, 2004

Simultaneous detection of C-reactive protein and other cardiac markers in human plasma using micromosaic immunoassays and self-regulating microfluidic networks
M Wolf, D Juncker, B Michel, P Hunziker, E Delamarche
Biosensors and Bioelectronics 19(10), 1193--1202, Elsevier, 2004

High-resolution patterning and transfer of thin PDMS films: fabrication of hybrid self-sealing 3D microfluidic systems
U. Kloter, H. Schmid, H. Wolf, B. Michel, D. Juncker
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on.(MEMS), pp. 745--748

Method for forming patterns for semiconductor devices
P S Andry, J C Flake, B Michel, T Tsujimura
US Patent App. 10/859,378, 2004 - Google Patents, Google Patents
US Patent App. 10/859,378

High-sensitivity miniaturized immunoassays for tumor necrosis factor a using microfluidic systems
H Kropshofer, B Michel, C Fattingerb, E Delamarche
Lab Chip4, 563-569, 2004


2003

Fabricating arrays of single proteins on glass using microcontact printing
Renault, J. P., Bernard, A., Bietsch, A., Michel, B., Bosshard, H. R., Kreiter, M., Hecht, B., Wild, U. and Delamarche, E.
J. Phys. Chem. B 107(3), 703-711, ACS Publications, 2003

Electroless deposition of NiB on 15 inch glass substrates for the fabrication of transistor gates for liquid crystal displays
E. Delamarche, M. Geissler, J. Vichiconti, W.S. Graham, P.A. Andry, J.C. Flake, P.M. Fryer, R.W. Nunes, B. Michel, E.J. O'Sullivan, others
Langmuir 19(14), 5923-5935, ACS Publications, 2003

Patterning NiB electroless deposited on glass using an electroplated Cu mask, microcontact printing, and wet etching
Emmanuel Delamarche, Matthias Geissler, Roy H Magnuson, Heinz Schmid, Bruno Michel
Langmuir 19(14), 5892--5897, ACS Publications, 2003

Direct patterning of NiB on glass substrates using microcontact printing and electroless deposition
Geissler, M., Kind, H., Schmidt-Winkel, P., Michel, B. and Delamarche, E.
Langmuir 19(15), 6283-6296, ACS Publications, 2003

Microcontact printing using poly (dimethylsiloxane) stamps hydrophilized by poly (ethylene oxide) silanes
E. Delamarche, C. Donzel, F.S. Kamounah, H. Wolf, M. Geissler, R. Stutz, P. Schmidt-Winkel, B. Michel, H.J. Mathieu, K. Schaumburg
Langmuir 19(21), 8749-8758, ACS Publications, 2003

Electroless deposition of Cu on glass and patterning with microcontact printing
Delamarche, E., Vichiconti, J., Hall, S., Geissler, M., Graham, W., Michel, B. and Nunes, R.
Langmuir 19(17), 6567-6569, ACS Publications, 2003


Fabricating arrays of single protein molecules on glass using microcontact printing
JP Renault, A Bernard, A Bietsch, B Michel, HR Bosshard, E Delamarche, M Kreiter, B Hecht, UP Wild
Journal of Physical Chemistry B-Condensed Phase 107(3), 703--711, Washington, DC: American Chemical Society, c1997-, 2003

Fabrication of metal nanowires using microcontact printing
M. Geissler, H. Wolf, R. Stutz, E. Delamarche, U.W. Grummt, B. Michel, A. Bietsch
Langmuir 19(15), 6301-6311, ACS Publications, 2003

Selective wet-etching of microcontact-printed Cu substrates with control over the etch profile
M. Geissler, H. Schmid, B. Michel, E. Delamarche
Microelectronic engineering67, 326-332, Elsevier, 2003


2002

Defect-tolerant and directional wet-etch systems for using monolayers as resists
M. Geissler, H. Schmid, A. Bietsch, B. Michel, E. Delamarche
Langmuir 18(6), 2374-2377, ACS Publications, 2002

Autonomous microfluidic capillary system
D. Juncker, H. Schmid, U. Drechsler, H. Wolf, M. Wolf, B. Michel, N. de Rooij, E. Delamarche
Analytical chemistry 74(24), 6139-6144, ACS Publications, 2002

Microfluidic capillary systems for the autonomous transport of bio/chemicals
Juncker, D., Schmid, H., Drechsler, U., Wolf, H., Michel, B., de Rooij, N. and Delamarche, E.
Proceedings of μTAS, pp. 952-954, 2002

Size and grain-boundary effects of a gold nanowire measured by conducting atomic force microscopy
Alexander Bietsch, Bruno Michel
Applied physics letters 80(18), 3346--3348, AIP Publishing, 2002

Printing meets lithography
Bruno Michel
Industrial Physicist 8(4), 16-19, 2002

Positive microcontact printing
E. Delamarche, M. Geissler, H. Wolf, B. Michel
Journal of the American Chemical Society 124(15), 3834-3835, ACS Publications, 2002

Printing meets lithography: soft approaches to high-resolution patterning
B. Michel, A. Bernard, A. Bietsch, E. Delamarche, M. Geissler, D. Juncker, H. Kind, J.P. Renault, H. Rothuizen, H. Schmid, others
CHIMIA International Journal for Chemistry 56(10), 527-542, Swiss Chemical Society, 2002

Fabricating microarrays of functional proteins using affinity contact printing
Jean Philippe Renault, André Bernard, David Juncker, Bruno Michel, Hans Rudolf Bosshard, Emmanuel Delamarche
Angewandte Chemie 114(13), 2426-2429, Wiley Online Library, 2002

Self-assembled monolayers of eicosanethiol on palladium and their use in microcontact printing
A Carvalho, M Geissler, H Schmid, B Michel, E Delamarche
Langmuir 18(6), 2406-2412, 2002


2001

Affinity capture of proteins from solution and their dissociation by contact printing
Bernard, A., Fitzli, D., Sonderegger, P., Delamarche, E., Michel, B., Bosshard, H. R. and Biebuyck, H. A.
Nature Biotechnology 19(9), 866-869, Nature Publishing Group, 2001

Soft and rigid two-level microfluidic networks for patterning surfaces
David Juncker, Heinz Schmid, Andr\'e Bernard, Isabelle Caelen, Bruno Michel, Nico de Rooij, Emmanuel Delamarche
Journal of Micromechanics and Microengineering 11(5), 532, IOP Publishing, 2001

Microfluidic networks made of polydimethylsiloxane, Si and Au coated with polyethylene glycol for patterning proteins onto surfaces
Papra, A., Bernard, A., Juncker, D., Larsen, N. B., Michel, B. and Delamarche, E.
Langmuir 17(13), 4090-4095, ACS Publications, 2001

Printing meets lithography: Soft approaches to high-resolution patterning
Bruno Michel, A Bernard, A Bietsch, E Delamarche, M Geissler, D Juncker, H Kind, JP Renault, H Rothuizen, H Schmid, others
IBM Journal of Research and Development 45(6), 870--870, 2001

Hydrophilic poly (dimethylsiloxane) stamps for microcontact printing
C. Donzel, M. Geissler, A. Bernard, H. Wolf, B. Michel, J. Hilborn, E. Delamarche
Advanced Materials 13(15), 1164-1167, Wiley Online Library, 2001

Micromosaic immunoassays
Bernard, A., Michel, B. and Delamarche, E.
Anal. Chem. 73(1), 8-12, ACS Publications, 2001


Contrast mechanisms in high-resolution contact lithography: A comparative study
M. Paulus, H. Schmid, B. Michel, O.J.F. Martin
Microelectronic engineering57, 109--116, Elsevier, 2001


2000

Conformal contact and pattern stability of stamps used for soft lithography
Alexander Bietsch, Bruno Michel
Journal of Applied Physics 88(7), 4310--4318, AIP Publishing, 2000

Formation of gradients of proteins on surfaces with microfluidic networks
Caelen, I., Bernard, A., Juncker, D., Michel, B., Heinzelmann, H. and Delamarche, E.
Langmuir 16(24), 9125-9130, ACS Publications, 2000

Microcontact printing of proteins
André Bernard, Jean Philippe Renault, Bruno Michel, Hans Rudolf Bosshard, Emmanuel Delamarche
Advanced Materials 12(14), 1067-1070, 2000

Microcontact-printing chemical patterns with flat stamps
M. Geissler, A. Bernard, A. Bietsch, H. Schmid, B. Michel, E. Delamarche, others
J. Am. Chem. Soc. 122(26), 6303-6304, ACS Publications, 2000

Siloxane polymers for high-resolution, high-accuracy soft lithography
H. Schmid, B. Michel
Macromolecules 33(8), 3042-3049, ACS Publications, 2000

Patterned electroless deposition of copper by microcontact printing palladium (II) complexes on titanium-covered surfaces
H. Kind, M. Geissler, H. Schmid, B. Michel, K. Kern, E. Delamarche
Langmuir 16(16), 6367-6373, ACS Publications, 2000

Electrical testing of gold nanostructures by conducting atomic force microscopy
A Bietsch, M A Schneider, M E Welland, B Michel
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures18, 1160, 2000


1999

Smart interface-to-device architecture for HMI
Buffa Michel, Sander Peter, Tigli Jean-Yves
Systems, Man, and Cybernetics, 1999. IEEE SMC'99 Conference Proceedings. 1999 IEEE International Conference on, pp. 1063--1068

Do chip size limits exist for DCA?
Andreas Schubert, Rainer Dudek, Rudolf Leutenbauer, Ralf Doring, Joachim Kloeser, H Oppermann, Bernd Michel, Herbert Reichl, Daniel F Baldwin, Jianmin Qu, others
Electronics Packaging Manufacturing, IEEE Transactions on 22(4), 255--263, IEEE, 1999

Contact-inking stamps for microcontact printing of alkanethiols on gold
L. Libioulle, A. Bietsch, H. Schmid, B. Michel, E. Delamarche
Langmuir 15(2), 300-304, ACS Publications, 1999

Near-field distribution in light-coupling masks for contact lithography
M Paulus, B Michel, O J F Martin
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures17, 3314, 1999


1998

CSP reliability studies performed with combined FEA and microDAC measurements
D Vogel, Juergen Auersperg, B Michel, R Mahidhara
Chip Scale Review 2(5), 76--82, 1998

Transport mechanisms of alkanethiols during microcontact printing on gold
E. Delamarche, H. Schmid, A. Bietsch, NB Larsen, H. Rothuizen, B. Michel, H. Biebuyck
The Journal of Physical Chemistry B 102(18), 3324-3334, ACS Publications, 1998

Light-coupling masks: An alternative, lensless approach to high-resolution optical contact lithography
H. Schmid, H. Biebuyck, B. Michel, O.J.F. Martin, N.B. Piller
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 16(6), 3422-3425, AVS, 1998

Qualis: The quality of service component for the Globus metacomputing system
Craig A Lee, Carl Kesselman, James Stepanek, Robert Lindell, B Scott Michel, Soonwook Hwang, Joseph Bannister, Ian Foster, Alain Roy
Proc. 6th Intl. Workshop on Quality of Service, pp. 140--142, 1998

Printing patterns of proteins
A. Bernard, E. Delamarche, H. Schmid, B. Michel, H.R. Bosshard, H. Biebuyck
Langmuir 14(9), 2225-2229, ACS Publications, 1998

Light-coupling masks for lensless, sub-wavelength optical lithography
H. Schmid, H. Biebuyck, B. Michel, O.J.F. Martin
Applied physics letters 72(19), 2379-2381, AIP, 1998

Microfluidic networks for chemical patterning of substrates: design and application to bioassays
E. Delamarche, A. Bernard, H. Schmid, A. Bietsch, B. Michel, H. Biebuyck
Journal of the American Chemical Society 120(3), 500-508, ACS Publications, 1998

Stamp for a lithographic process
H A Biebuyck, B Michel
US Patent 5,817,242, 1998 - Google Patents, Google Patents
US Patent 5,817,242

Cantilever deflection sensor and use thereof
J P M Bourgoin, M B Johnson, B Michel
US Patent 5,804,709, 1998 - Google Patents, Google Patents
US Patent 5,804,709

Energy flow in light-coupling masks for lensless optical lithography
O.J.F. Martin, N.B. Piller, H. Schmid, H. Biebuyck, B. Michel, others
Opt. Express 3(7), 280-285, OSA, 1998


1997

Order in microcontact printed self-assembled monolayers
Larsen, N. B., Biebuyck, H. A., Delamarche, E. and Michel, B.
J. Am. Chem. Soc. 119(13), 3017-3026, ACS Publications, 1997

Stability of molded polydimethylsiloxane microstructures
Emmanuel Delamarche, Heinz Schmid, Bruno Michel, Hans Biebuyck
Advanced Materials 9(9), 741--746, Wiley Online Library, 1997

Patterned delivery of immunoglobulins to surfaces using microfluidic networks
E. Delamarche, A. Bernard, H. Schmid, B. Michel, H. Biebuyck
Science 276(5313), 779-781, American Association for the Advancement of Science, 1997

Lithography beyond light: Microcontact printing with monolayer resists
Hans A Biebuyck, Niels B Larsen, Emmanuel Delamarche, Bruno Michel
IBM Journal of Research and Development 41(1.2), 159-170, IBM, 1997

Logarithmic current-to-voltage converter for local probe microscopy
U. Durig, L. Novotny, B. Michel, A. Stalder
Review of Scientific Instruments 68(10), 3814-3816, AIP, 1997

Making gold nanostructures using self-assembled monolayers and a scanning tunneling microscope
E Delamarche, ACF Hoole, B Michel, S Wilkes, M Despont, ME Welland, H Biebuyck
J. Phys. Chem. B 101(45), 9263-9269, 1997


1996


Immobilization of antibodies on a photoactive self-assembled monolayer on gold
E. Delamarche, G. Sundarababu, H. Biebuyck, B. Michel, C. Gerber, H. Sigrist, H. Wolf, H. Ringsdorf, N. Xanthopoulos, HJ Mathieu
Langmuir 12(8), 1997-2006, ACS Publications, 1996

Structure and stability of self-assembled monolayers
Delamarche, E. and Michel, B.
Thin Solid Films 273(1), 54-60, Elsevier, 1996

Golden interfaces: The Surface of Self-Assembled Monolayers
Emmanuel Delamarche, Bruno Michel, Hans A Biebuyck, Christoph Gerber
Advanced Materials 8(9), 719-729, Wiley Online Library, 1996


1995

Doping profiling with scanning surface harmonic microscopy
MB Johnson, J-P Bourgoin, B Michel
Microelectronic engineering 27(1), 539--542, Elsevier, 1995

Characterization of electron beam induced modification of thermally grown SiO2
JR Barnes, ACF Hoole, MP Murrell, ME Welland, AN Broers, JP Bourgoin, H Biebuyck, MB Johnson, B Michel
Applied physics letters 67(11), 1538--1540, AIP Publishing, 1995

End-group-dominated molecular order in self-assembled monolayers
H. Wolf, H. Ringsdorf, E. Delamarche, T. Takami, H. Kang, B. Michel, C. Gerber, M. Jaschke, H.J. Butt, E. Bamberg
The Journal of Physical Chemistry 99(18), 7102-7107, ACS Publications, 1995

Recognition of individual tail groups in self-assembled monolayers
T. Takami, E. Delamarche, B. Michel, C. Gerber, H. Wolf, H. Ringsdorf
Langmuir 11(10), 3876-3881, ACS Publications, 1995

Local probe investigation of molecular material
B Michel
Biosensors and Bioelectronics 10(1-2), 85--98, Elsevier, 1995

Characterization of electron beam induced modification of thermally grown SiO
JR Barnes, ACF Hoole, MP Murrell, ME Welland, AN Broers, JP Bourgoin, H Biebuyck, MB Johnson, B Michel
Applied Physics Letters67, 1538, 1995


1994

Combined scanning tunneling and force microscopy
Dario Anselmetti, A Baratoff, H-J Güntherodt, Ch Gerber, B Michel, H Rohrer
Journal of Vacuum Science & Technology B 12(3), 1677-1680, AVS: Science & Technology of Materials, Interfaces, and Processing, 1994

Semiconductor characterization with the scanning surface harmonic microscope
J-P Bourgoin, MB Johnson, B Michel
Applied physics letters 65(16), 2045--2047, AIP Publishing, 1994

Domain and molecular superlattice structure of dodecanethiol self-assembled on Au (111)
D. Anselmetti, A. Baratoff, H.J. Güntherodt, E. Delamarche, B. Michel, C. Gerber, H. Kang, H. Wolf, H. Ringsdorf
EPL (Europhysics Letters) 27(5), 365, IOP Publishing, 1994

Structure of Hydrophilic Self-Assembled Monolayers: A Combined Scanning Tunneling Microscopy and Computer Simulation Study
M. Sprik, E. Delamarche, B. Michel, U. Roethlisberger, M. L. Klein, H. Wolf, and H. Ringsdorf
Langmuir 10(11), 4116--4130, ACS Publications, 1994

Thermal stability of self-assembled monolayers
Delamarche, E., Michel, B., Kang, H. and Gerber, Ch.
Langmuir 10(11), 4103-4108, ACS Publications, 1994

Real-space observation of nanoscale molecular domains in self-assembled monolayers
E Delamarche, B Michel, Ch Gerber, Dario Anselmetti, H-J Güntherodt, H Wolf, H Ringsdorf
Langmuir 10(9), 2869-2871, ACS Publications, 1994

Scanning surface harmonic microscopy: Application to silicon and Langmuir-Blodgett films on silicon
J P Bourgoin, M B Johnson, B Michel
Microscopy Microanalysis Microstructures 5(4-6), 535--543, edpsciences. org, 1994


1993


Scanning surface harmonic microscopy of self-assembled monolayers on gold
W. Mizutani, B. Michel, R. Schierle, H. Wolf, H. Rohrer
Applied physics letters 63(2), 147-149, AIP, 1993

Local Probe Investigation of Self-Assembled Monolayers
W Mizutani, D Anselmetti, B Michel
Computations for the nano-scale, 43, Springer, 1993

Deformation-free topography from combined scanning force and tunnelling experiments
D. Anselmetti, C. Gerber, B. Michel, H. Wolf, HJ Güntherodt, H. Rohrer
EPL (Europhysics Letters)23, 421, IOP Publishing, 1993


1992

Low-temperature compatible I-V converter
B. Michel, L. Novotny, U. Dürig
Ultramicroscopy42, 1647-1652, Elsevier, 1992

Scanning surface harmonic microscopy: Scanning probe microscopy based on microwave field-induced harmonic generation
B Michel, W Mizutani, R Schierle, A Jarosch, W Knop, H Benedickter, W Bächtold, H Rohrer
Review of scientific instruments 63(9), 4080-4085, AIP Publishing, 1992

Compact, combined scanning tunneling/force microscope
Dario Anselmetti, Ch Gerber, B Michel, H-J Guntherodt, H Rohrer
Review of Scientific Instruments 63(5), 3003-3006, AIP Publishing, 1992


1991

STM in Biology
B Michel
Highlights in Condensed Matter Physics and Future Prospects, pp. 549--572, Springer, 1991

Direct observation of streptavidin specifically adsorbed on biotin-functionalized self-assembled monolayers with the scanning tunneling microscope
Lukas Häussling, Bruno Michel, Helmut Ringsdorf, Heinrich Rohrer
Angewandte Chemie International Edition in English 30(5), 569-572, Wiley Online Library, 1991

Apical membrane ionic channels in the rabbit cortical thick ascending limb in primary culture
Jean Merot, Poncet Val´rie, Bidet Michel, Tauc Michel, Poujeol Philippe
Biochimica et Biophysica Acta (BBA)-Biomembranes 1070(2), 387-400, Elsevier, 1991

Rastertunnelmikroskopische Beobachtung von spezifisch adsorbiertem Streptavidin auf Biotin-funktionalisierten, selbstorganisierten Monoschichten
B Michel, H Rohrer, H Ringsdorf, D C L Häussling
Angewandte Chemie 103(5), WILEY-VCH Verlag GmbH Weinheim, 1991


1990

Imaging and conductivity of biological and organic material
G Travaglini, M Amrein, B Michel, H Gross
Scanning tunneling microscopy and related methods, 335, Springer, 1990


1989

Images of crystalline alkanes obtained with scanning tunneling microscopy
B Michel, G Travaglini, H Rohrer, C Joachim, M Amrein
Zeitschrift fuer Physik B Condensed Matter 76(1), 99-105, Springer, 1989

The cytochrome c oxidase-cytochrome c complex: spectroscopic analysis of conformational changes in the protein-protein interaction domain
B Michel, A E I Proudfoot, C J A Wallace, H R Bosshard
Biochemistry 28(2), 456--462, American Chemical Society, 1989


1988

An STM for biological applications: Bioscope
B Michel, G Travaglini
Journal of Microscopy 152(3), 681-685, Wiley Online Library, 1988