Satya V. Nitta  Satya V. Nitta photo       

contact information

Master Inventor. Program Leader. Cognitive Computing for Education.
Thomas J. Watson Research Center, Yorktown Heights, NY USA
  +1dash914dash945dash1557

links



2011

Frontiers of information technology
Donna E Dillenberger, Dario Gil, Satya V Nitta, Mark B Ritter
IBM Journal of Research and Development 55(5), 1--1, IBM, 2011


2009

Pore orientation and silylation effects on mesoporous silica film properties
AP Singh, DD Gandhi, B Singh, E Simonyi, EG Liniger, SV Nitta, MW Lane, G Ramanath
Applied Physics Letters 94(9), 093502, AIP Publishing, 2009


2008

Performance and reliability of airgaps for advanced BEOL interconnects
S Nitta, D Edelstein, S Ponoth, L Clevenger, X Liu, T Standaert
Interconnect Technology Conference, 2008. IITC 2008. International, pp. 191--192

Self-assembly based air-gap integration
Shom Ponoth, Dave Horak, Satya Nitta, Matthew Colburn, Greg Breyta, Elbert Huang, Jeanne Tania Sucharitaves, Howard Landis, Anthony Lisi, Xiao Liu, others
Meeting Abstracts, pp. 2074--2074, 2008


2006


Analysis of Plasma-Induced Modification of ULK and eULK Materials: Dual Damascene Processing Challenges for 45nm (K⩽ 2.4) and Beyond BEOL Technologies
NCM Fuller, MA Worsley, S Nitta, T Dalton, TL Tai, S Bent, T Magbitang, G Dubois, R Miller, W Volksen, others
Interconnect Technology Conference, 2006 International, pp. 24--26

BEOL Integration of Highly Damage-Resistant Porous Ultra Low-K Material Using Direct CMP and Via-first Process
T Iijima, Q Lin, S Chen, C Labelle, N Fuller, S Ponoth, S Cohen, J Lloyd, D Dunn, C Muzzy, others
Interconnect Technology Conference, 2006 International, pp. 21--23

A 45 nm CMOS node Cu/Low-k/Ultra Low-k PECVD SiCOH (k= 2.4) BEOL technology
S Sankaran, S Arai, R Augur, M Beck, G Biery, T Bolom, G Bonilla, O Bravo, K Chanda, M Chae, others
Electron Devices Meeting, 2006. IEDM'06. International, pp. 1--4


2005

Nanoporous Materials Integration Into Advanced Microprocessors
E Todd Ryan, Cathy Labelle, Satya Nitta, Nicholas Fuller, Griselda Bonilla, Kenneth McCullough, Charles Taft, Hong Lin, Andrew Simon, Eva Simonyi, others
MRS Proceedings, pp. B2--1, 2005


2004

Successful dual damascene integration of extreme low k materials (k< 2.0) using a novel gap fill based integration scheme
S Nitta, S Purushothaman, S Smith, M Krishnan, D Canaperi, T Dalton, W Volksen, RD Miller, B Herbst, C-K Hu, others
Electron Devices Meeting, 2004. IEDM Technical Digest. IEEE International, pp. 321--324


2003

Copper BEOL interconnects for silicon CMOS logic technology
Satya V Nitta, Sampath Purushothaman, James G Ryan, Daniel C Edelstein, Panayotis Andricacos, Chao-Kun Hu, Thomas M Shaw, Robert Rosenberg, James R Lloyd
Interconnect Technology and Design for Gigascale Integration, pp. 35--65, Springer, 2003


2002

Electrical integrity of state-of-the-art 0.13 $\mu$m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
KW Guarini, AW Topol, M Ieong, R Yu, L Shi, MR Newport, DJ Frank, DV Singh, GM Cohen, SV Nitta, others
IEDm: international electron devices meeting, pp. 943--945, 2002


2001

Opportunities and challenges in ultra low k dielectrics for interconnect applications
S Nitta Purushothaman, SV Ryan, JG Narayan, C Krishnan, M Cohen, S Whiteha S Gates
2001 - lw20.com


2000

Copper and Low-k dielectric integration challenges
JG Ryan, MB Anand, G Biery, C Davis, P Duncombe, D Edelstein, S Gates, S Greco, J Hedrick, P Jones, others
Low-k dielectric materials technology Seminar, SEMICON West, 2000


1999

Processing and characterization of silica xerogel films for low-K dielectric applications
Anurag Jain, Svetlana Rogojevic, Satya V Nitta, Venumadhav Pisupatti, William N Gill, Peter C Wayner, Joel L Plawsky, TEFM Standaert, GS Oehrlein
MRS Proceedings, pp. 29, 1999

Surface modified spin-on xerogel films as interlayer dielectrics
SV Nitta, V Pisupatti, A Jain, PC Wayner Jr, WN Gill, JL Plawsky
Journal of Vacuum Science \& Technology B 17(1), 205--212, AVS: Science \& Technology of Materials, Interfaces, and Processing, 1999

Effect of sol rheology on the uniformity of spin-on silica xerogel films
SV Nitta, A Jain, PC Wayner Jr, WN Gill, JL Plawsky
Journal of applied physics 86(10), 5870--5878, AIP Publishing, 1999


1998


Fabrication and characterization of spin-on silica xerogel films
S Nitta, A Jain, V Pisupatti, WN Gill, PC Wayner, JL Plawsky
MRS Proceedings, pp. 99, 1998