Evan G Colgan  Evan G Colgan photo       

contact information

Research Staff Member
Thomas J. Watson Research Center, Yorktown Heights, NY USA
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Professional Associations

Professional Associations:  American Physical Society (APS)  |  IEEE, Senior Member  |  Materials Research Society (MRS)  |  Sigma Xi


2017

Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
Parida, Pritish R and Sridhar, Arvind and Schultz, Mark and Yang, Fanghao and Gaynes, Michael and Colgan, Evan and Dang, Bing and McVicker, Gerard and Brunschwiler, Thomas and Knickerbocker, John and others
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2017 33rd, pp. 130--138
Abstract

Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules
Wang, Chao and Nam, Sung-Wook and Cotte, John M and Jahnes, Christopher V and Colgan, Evan G and Bruce, Robert L and Brink, Markus and Lofaro, Michael F and Patel, Jyotica V and Gignac, Lynne M and others
Nature communications8, 14243, Nature Publishing Group, 2017
Abstract


2016

Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
Dang, Bing and Colgan, Evan and Yang, Fanghao and Schultz, Mark and Liu, Yang and Chen, Qianwen and Nah, Jae-Woong and Polastre, Robert and Gaynes, Michael and McVicker, Gerard and others
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, pp. 1271--1277
Abstract

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels
Schultz, Mark and Yang, Fanghao and Colgan, Evan and Polastre, Robert and Dang, Bing and Tsang, Cornelia and Gaynes, Michael and Parida, Pritish and Knickerbocker, John and Chainer, Timothy
Journal of Electronic Packaging 138(2), 021005, American Society of Mechanical Engineers, 2016
Abstract

Boiling sensitivity analysis of asymmetrically heated micro-scale devices
Yang, Fanghao and Schultz, Mark D and Parida, Pritish R and Colgan, Evan G and Dang, Bing and McVicker, Gerard and Chainer, Timothy
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on, pp. 1409--1414
Abstract


2015

Hydrodynamics of diamond-shaped gradient nanopillar arrays for effective DNA translocation into nanochannels
Wang, Chao and Bruce, Robert L and Duch, Elizabeth A and Patel, Jyotica V and Smith, Joshua T and Astier, Yann and Wunsch, Benjamin H and Meshram, Siddharth and Galan, Armand and Scerbo, Chris and others
ACS nano 9(2), 1206--1218, ACS Publications, 2015
Abstract

Local measurements of flow boiling heat transfer on hot spots in 3D compatible radial microchannels
Yang, Fanghao and Schultz, Mark and Parida, Pritish and Colgan, Evan and Polastre, Robert and Dang, Bing and Tsang, Cornelia and Gaynes, Michael and Knickerbocker, John and Chainer, Timothy
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, pp. V003T10A006--V003T10A006
Abstract

Embedded two-phase cooling of large 3D compatible chips with radial channels
Schultz, Mark and Yang, Fanghao and Colgan, Evan and Polastre, Robert and Dang, Bing and Tsang, Cornelia and Gaynes, Michael and Parida, Pritish and Knickerbocker, John and Chainer, Timothy
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, pp. V003T10A007--V003T10A007
Abstract

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle and Kenneth E. Goodson
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels


2014

Clog-free translocation of long DNA in nanofluidic pillar arrays and 30 nm wide channels: A fabrication and hydrodynamic study
Wang, Chao and Bruce, Robert L and Duch, Elizabeth A and Patel, Jyotica V and Smith, Joshua T and Astier, Yann and Colgan, Evan G and Lin, Qinghuang and Stolovitzky, Gustavo
18th International Conference on Miniaturized Systems for Chemistry and Life Sciences, MicroTAS 2014
Abstract


2013

Measured thermal resistance of microbumps in 3D chip stacks
EG Colgan and J Wakil
Electronics Cooling, March 2013, 34-37

200 mm wafer-scale integration of sub-20 nm sacrificial nanofluidic channels for manipulating and imaging single DNA molecules
Wang, Chao and Nam, SW and Cotte, John M and Peng, H and Jahnes, CV and Wang, D and Bruce, R and Guillorn, M and Gignac, LM and Advocate, WH and others
Electron Devices Meeting (IEDM), 2013 IEEE International, pp. 14--1
Abstract

Measurement of back end of line thermal resistance for 3D chip stacks
E. G. Colgan, R. J. Polastre, J. Knickerbocker, J. Wakil, J. Gambino, K. Tallman
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE, pp. 23-28


2012

2.5 D and 3D technology challenges and test vehicle demonstrations
JU Knickerbocker, PS Andry, E Colgan, B Dang, T Dickson, X Gu, C Haymes, C Jahnes, Y Liu, J Maria, others
2012 IEEE 62nd Electronic Components and Technology Conference, pp. 1068--1076

Measurement of microbump thermal resistance in 3D chip stacks
EG Colgan, P Andry, B Dang, JH Magerlein, J Maria, RJ Polastre, J Wakil
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, pp. 1--7


2011

Back-End-of-Line and Micro-C4 Thermal Resistance Contributions to 3-D Stack Packages
J Wakil, E G Colgan, C SHAOCHEN
IEEE Trans. Components, Packaging and Manufacturing Technology 1(7), 1007-1014, 2011


2009

Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems
Colgan, Evan G and Iyengar, Madhusudan K
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability, pp. 799--806
Abstract

Hotspot-adapted cold plates to maximize system efficiency
Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, B Michel, Evan Colgan, Pepe Bezama
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, pp. 150--156


2008

BEOL thermal characterization for 3-D packaging
Wakil, J and Colgan, EG and Jiang, L and Chen, S and Sikka, K
Proceedings, 41st IMAPS Symposium, 2008

Thermal modeling of on-chip interconnects and 3D packaging using EM tools
Lijun Jiang, Seshadri Kolluri, Barry J Rubin, Howard Smith, EG Colgan, MR Scheuermann, JA Wakil, A Deutsch, J Gill
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, pp. 279--282


2007

A practical implementation of silicon microchannel coolers
EG Colgan, RJ Bezama, M Gaynes and KC Marston
Electronics Cooling, November 2007 13(4), 18-23

SPECIAL SECTION ON SEMI-THERM 2005-SPECIAL SECTION PAPERS-A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
EG Colgan, B Furman, M Gaynes, WS Graham, NC LaBianca, JH Magerlein, RJ Polastre, MB Rothwell, RJ Bezama, R Choudhary, others
IEEE Transactions on Electronics Packaging Manufacturing 30(3), 218--220, New York, NY: Institute of Electrical and Electronics Engineers, c1999-, 2007

High performance and subambient silicon microchannel cooling
EG Colgan, B Furman, M Gaynes, N LaBianca, JH Magerlein, R Polastre, R Bezama, K Marston, R Schmidt
Journal of Heat Transfer129, 1046, 2007


2006

High Performance and Sub-ambient Silicon Microchannel Cooling
EG Colgan, B Furman, M Gaynes, N LaBianca, JH Magerlein, R Polastre, R Bezama, K Marston, and R. Schmidt
4th International Conference on nanochannels, Microchannels, and Minichannels (ICNMM2006)

Silicon Microchannel Cooling for High Power Chips
EG Colgan, B Furman, M Gaynes, N LaBianca, J Magerlein, R Polastre, RJ Bezama, R Choudhary, K Marston, H Toy
INTERNATIONAL JOURNAL OF HEATING VENTILATION AIR CONDITIONING AND REFRIGERATING RESEARCH 12(4), 1031, 2006

Development of an experimental facility for investigating single-phase liquid flow in microchannels
M Steinke, S Kandlikar, J Magerlein, E Colgan, A Raisanen
Heat Transfer Engineering 27(4), 41--52, Taylor and Francis Ltd, 2006

System-on-package (SOP) technology, characterization and applications
J. U. Knickerbocker, P. S. Andry, L. P. Buchwalter, E. G. Colgan, J. Cotte, H. Gan, R. R. Horton, S. M. Sri-Jayantha, J. H. Magerlein, D. Manzer, G. McVicker, C. S. Patel, R. J. Polastre, E. S. Sprogis, C. K. Tsang, B. C. Webb, S. L. Wright
56th Electronic Components and Technology Conference 2006, pp. 7 pp.-


2005

Novel packaging of parallel-optical interconnects for high-end servers
S A Rosenau, J Simon, L A Buckman Windover, B Law, G M Flower, E DeGroot, A Grot, M J Nystrom, C K Lin, A Tandon, others
Optical Fiber Communication Conference, 2005

Direct integration of dense parallel optical interconnects on a first level package for high-end servers
E G Colgan, B Furman, J H Magerlein, J Schaub, C Schow, D Stigliani Jr, J Torok, A Benner, D Becker, G Katopis, others
Electronic Components and Technology Conference, 2005, pp. 228--233

A practical implementation of silicon microchannel coolers for high power chips
EG Colgan, B Furman, A Gaynes, W Graham, N LaBianca, JH Magerlein, RJ Polastre, MB Rothwell, RJ Bezama, R Choudhary, others
2005 IEEE Twenty First Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 1--7


2004

Liquid Crystal Displays Backlit with LEDs
Y Taira, H Numata, D Nakano, K Sueoka, F Yamada, and E Colgan
Conf. on Lasers and Electro-Optics (CLEO), Vol. 1, 2004

Silicides
Gambino, JP and Colgan, EG
Encyclopaedia of Applied Physics, 201--248, 2004


2003

Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench
C Schuster, DM Kuchta, EG Colgan, GM Cohen, JM Trewhella
Electrical Performance of Electronic Packaging, 2003, 63--66

Making a color LCD without color filters
Y Taira, F Yamada, M Suzuki, E G Colgan
Information Display 19(4/5), 40--45, SID SOCIETY FOR INFORMATION DISPLAY, 2003

Color Filterless Liquid Crystal Display Illuminated with LEDs
Y Taira, H Numata, D Nakano, K Sueoka, F Yamada, M Suzuki, M Noguchi, R Singh, E G Colgan
SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, pp. 1250--1253, 2003


2002

Illumination System for Color Filterless Liquid Crystal Display
Y Taira, D Nakano, H Numata, A Nishikai, K Sueoka, F Yamada, M Suzuki, M Noguchi, R Singh and EG Colgan
EuroDisplay 02 Digest of Technical papers, pp. 585, 2002

Low-power LCD using a novel optical system
Y Taira, D Nakano, H Numata, A Nishikai, S Ono, F Yamada, M Suzuki, M Noguchi, R Singh, EG Colgan
SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, pp. 1313--1315, 2002


2000

Technology Trend of Large Size and High Resolution Direct-View TFT-LCD
H Kitahara, E Colgan, K Schleupen
SID'00 Digest, 1108--1111, 2000


1999

High resolution AMLCD made with a-Si TFTs and a five mask Al gate process
H. Kinoshita, H Kitahara, K. Schleupen, EG Colgan and R Nunes
SID 99 Digest of Technical Papers, pp. 736, 1999

High-Information-Content Color 16.3
J Ritsko, K Schleupen, P Alt, P Andry, S Asaad, E Colgan, P Fryer, E Galligan, W Graham, P Greier
IS AND T ANNUAL CONFERENCE, pp. 184--188, 1999

High-resolution AMLCD made with a-Si: H TFTs and an Al gate and IZO structure
H Kinoshita, H Kitahara, K Schleupen, EG Colgan, R Nunes, M Kodate, S Takasugi
Journal of the Society for Information Display7, 265, 1999


1998

Optimization of light valve mirrors
EG Colgan, F Doany, M Lu, A Rosenbluth, K-H Yang, M. Uda, M Shinohara, T Tomooka, and T. Tsukamoto
SID 98 Digest of Technical Papers, pp. 1071, 1998

Silicides and ohmic contacts
JP Gambino, EG Colgan
Materials Chemistry and Physics 52(2), 99--146, Elsevier, 1998

Electrical test sites for AMLCD-TFT array process characterization
EG Colgan, RJ Polastre, M Takeichi, RL Wisnieff
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, pp. 79--84, 1998

Optimization of light-valve mirrors
EG Colgan, F Doany, M Lu, A Rosenbluth, K H Yang, M Uda, M Shinohara, T Tomooka, T Tsukamoto
Journal of the Society for Information Display6, 247, 1998

High Conductivity Gate Metallurgy For TFT/LCD's
P M Fryer, E Colgan, E Galligan, W Graham, R Horton, L Jenkins, R John, Y Kuo, K Latzko, F Libsch, others
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, pp. 37--46, 1998

The thermal stability of CoSi2 on polycrystalline silicon: The effect of silicon grain size and metal thickness
Gambino, JP and Colgan, EG and Domenicucci, AG and Cunningham, B
Journal of The Electrochemical Society 145(4), 1384--1389, The Electrochemical Society, 1998
Abstract

Interdiffusion and phase formation in Cu (Sn) alloy films
LA Clevenger, B Arcot, W Ziegler, EG Colgan, QZ Hong, C Cabral Jr, TA Gallo, JME Harper
Journal of Applied Physics83, 90, 1998

Thin-film-transistor process-characterization test structures
EG Colgan, RJ Polastre, M Takeichi, RL Wisnieff
IBM Journal of Research and Development 42(3-4), 481--490, IBM Corp. Riverton, NJ, USA, 1998

Multi-Domain Homeotropic Liquid Crystal Display Based on Ridge and Fringe Field Structure
A Shui-Chih, CAI Chen, W N Ronald, A Richard, A G Eileen, E COLGAN, S W John
Japanese Journal of Applied Physics37, L597--L599, 1998

Ridge and Fringe-Field Multi-Domain Homeotropic LCD
A Lien, R Nunes, RA John, E Galligan, E Colgan, J Wilson, C Cai
SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, pp. 1123--1126, 1998

Evaluation of Al (Nd)-alloy films for application to thin-film-transistor liquid crystal displays
T H C C H JME, EG Colgan
IBM Journal of Research and Development 42(3-4), 501--508, 万方数据资源系统, 1998

High Information Content Color 16.3 Desktop AMLCD with 15.7 Million a-Si: H TFTs
K Schleupen, P Alt, P Andry, S Asaad, E Colgan, P Fryer, E Galligan, W Graham, P Greier, R Horton, others
Proceedings of the 18th International Display Research Conference, Asia Display’98, pp. 187--190, 1998

A 10.5-in.-diagonal SXGA active-matrix display
EG Colgan, PM Alt, RL Wisnieff, PM Fryer, EA Galligan, WS Graham, PF Greier, RR Horton, H Ifill, LC Jenkins, others
IBM Journal of Research and Development 42(3-4), 427--444, IBM Corp. Riverton, NJ, USA, 1998

Design and Fabrication of a Prototype Projection Data Monitor with High Information Content
R. L. Melcher, et al C. Narayan
IBM Journal of Research and Development 42(3/4), 321--338, IBM Corp. Riverton, NJ, USA, 1998

On-chip metallization layers for reflective light valves
EG Colgan, M Uda
IBM Journal of Research and Development 42(3-4), 339--345, IBM Corp. Riverton, NJ, USA, 1998


1997

In-plane crystallographic texture of BCC metal thin films on amorphous substrates
JME Harper, KP Rodbell, EG Colgan, RH Hammond
Polycrystalline thin films- Structure, texture, properties and applications III, 27--32, 1997

A six-mask TFT-LCD process using copper-gate metallurgy
PM Fryer, E Colgan, E Galligan, W Graham, R Horton, D Hunt, L Jenkins, R John, P Koke, Y Kuo, others
Journal of the Society for Information Display5, 49, 1997

Control of in-plane texture of body centered cubic metal thin films
JME Harper, KP Rodbell, EG Colgan, RH Hammond
Journal of Applied Physics82, 4319, 1997


1996

A six mask TFT-LCD process using copper gate metallurgy
PM Fryer, E Colgan, E Galligan, W Graham, R. Horton, D Hunt, K Latzko and others
SID International Symposium Digest of Technical Papers XXVII, 1996

Copper gate process for high information content a-Si TFT LCDs
EG Colgan, PM Fryer, E. Galligan, W. Graham, R. Horton, D. Hunt, K. Latzko and others
AMLCD '96 / IDW '96, 1996

Phase Formation in Cu (Sn) Alloy Thin Films
Clevenger, LA and Arcot, B and Ziegler, W and Colgan, EG and Hong, QZ and d'Heurle, FM and Cabral, C and Gallo, TA and Harper, JME
MRS Online Proceedings Library Archive427, Cambridge University Press, 1996
Abstract



Electromigration Drift Velocity in Al-Alloy and Cu-Alloy Lines
C K Hu, KY Lee, KL Lee, C Cabral Jr, EG Colgan, C Stanis
Journal of the Electrochemical Society143, 1001, 1996

Nickel silicide thermal stability on polycrystalline and single crystalline silicon
EG Colgan, JP Gambino, B Cunningham
Materials Chemistry \& Physics 46(2-3), 209--214, Elsevier, 1996

Formation and stability of silicides on polycrystalline silicon
EG Colgan, JP Gambino, QZ Hong
Materials Science \& Engineering R 16(2), 43--96, Elsevier, 1996


1995

Electromigration drift velocity in Al-alloy and Cu-alloy lines
C-K Hu, KY Lee, KL Lee, C Cabral, EG Colgan, and C. Stanis
Electrochemical Society Proc., pp. 203, 1995

Activation energy for CoSi and CoSi2 formation measured during rapid thermal annealing
EG Colgan, C Cabral, DE Kotecki
Journal of applied physics 77(2), 614--619, AIP, 1995

Interconnect fabrication processes and the development of low-cost wiring for CMOS products
TJ Licata, EG Colgan, JME Harper, SE Luce
IBM J. Res. and Dev. 39(4), 419, Elsevier, 1995

In-Situ Resistance Measurements During Rapid Thermal Annealing for Process Characterization
EG Colgan, C Cabral, LA Clevenger, JME Harper
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, pp. 49--54, 1995

Activation energy for Pt 2 Si and PtSi formation measured over a wide range of ramp rates
Colgan, EG
Journal of materials research 10(8), 1953--1957, Cambridge University Press, 1995
Abstract

Selective CVD-W for capping damascene Cu lines
EG Colgan
Thin Solid Films 262(1-2), 120--123, Elsevier, 1995


1994

Blanket Al(Cu) thin film and fine line grain growth, Al2Cu precipitation and dissolution kinetics
EG Colgan, KP Rodbell, C Cabral, and JME Harper
Mat. Res. Soc. Conf. Proc. ULSI-IX, pp. 257, 1994




Rapid Evaluation of Thin Film Interfacial Reactions Using Temperature-Ramped Measurements
JME Harper, LA Clevenger, EG Colgan, C Cabral Jr, B Arcot
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, pp. 307--307, 1994

Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines
EG Colgan, KP Rodbell, C Cabral, JME Harper
Journal of applied physics 76(5), 2781--2790, AIP, 1994

Materials issues in copper interconnections
JME Harper, EG Colgan, CK Hu, JP Hummel, LP Buchwalter, CE Uzoh
MRS Bull 19(8), 23--29, 1994



1993

The Effect of Annealing on the Cu Distribution and Al2 Cu Precipitation in Al(Cu) Thin Films
Colgan, EG and Rodbell, KP and Vigliotti, DR
MRS Online Proceedings Library Archive309, Cambridge University Press, 1993
Abstract

Use of Selective CVD-W with a Polyimide Mask for Local Interconnects
EG Colgan
Journal of The Electrochemical Society140, 485, 1993

Reactor Issues Important for the Deposition of Selective Tungsten by Chemical Vapor Deposition Using the SiH4 Reduction of WF6
DE Kotecki, E G Colgan, A Rose
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS, pp. 371--371, 1993

Characterization of Encroachment of Selective Chemical Vapor Deposition of Tungsten at the Edge of Contacts
EG Colgan, JP Gambino, RH Kastl
Journal of The Electrochemical Society140, 159, 1993

Planar Copper-Polyimide Back End of the Line Interconnections for ULSI Devices
B Luther, JF White, C Uzoh, T Cacouris, J Hummel, W Guthrie, N Lustig, S Greco, N Greco, S Zuhoski, others
Proceedings of the 9th VMIC, 1993


1992

EFFECT OF SELECTIVE CVD-W CONTACTS ON SHALLOW JUNCTIONS AS A FUNCTION OF PLASMA PRECLEAN CONDITIONS
JP GAMBINO, EG COLGAN, B CUNNINGHAM
Advanced metallization for ULSI applications: proceedings of the conference held October 8-10, 1991, at AT\&T Bell Laboratories, Murray Hill, New Jersey, USA, and October 28-30, 1991, Tokyo, Japan, pp. 249, 1992

Formation of TiN-encapsulated copper structures in a NH3 ambient
J Li, JW Mayer, Y Shacham-Diamand, EG Colgan
Applied physics letters 60(24), 2983--2985, AIP, 1992

The Resistance and Morphology of submicron TiSi2 and CoSi2 lines on Polysilicon
JP Gambino, EG Colgan, and B Cunningham
Interconnection and Contact Metallizations for ULSI, pp. 264, Electrochem. Soc. Inc., 1992


RESISTIVITY OF SiH4 REDUCED SELECTIVE CVD-W
EG COLGAN, P RONSHEIM, JD CHAPPLE-SOKOL
Advanced metallization for ULSI applications: proceedings of the conference held October 8-10, 1991, at AT\&T Bell Laboratories, Murray Hill, New Jersey, USA, and October 28-30, 1991, Tokyo, Japan, pp. 263, 1992

Characterization of selective chemical vapor deposited tungsten using SiH4 reduction
EG Colgan, JD Chapple-Sokol
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures 10(3), 1156--1166, AVS, 1992

Chemical mechanical Polishing to Planarize Blanket and Selective CVD Tungsten
WL Guthrie, M. Desai, EG Colgan, and RP Singh
Advanced Metallizations for ULSI Applications, pp. 527, Materials Research Society, 1992


1991

Effects of oxygen in TiNx on the diffusion of Cu in Cu/TiN/Al and Cu/TiNx/Si structures
JO Olowolafe, J Li, JW Mayer, EG Colgan
Applied physics letters 58(5), 469--471, AIP, 1991

Selective CVD Tungsten Films for Microelectronics
EG Colgan
Tungsten and Tungsten Alloys: Recent Advances, 257--264, 1991

Thermal stability issues in copper based metallization
J Li, Y Shacham-Diamond, JW Mayer, EG Colgan
VLSI Multilevel Interconnection Conference, 1991, Proceedings, pp. 153--159

Solutions to current crowding in circular vias for contact resistance measurements
LH Allen, MY Zhang, JW Mayer, EG Colgan, R Young
Journal of Applied Physics 70(1), 253--258, 1991

Oxidation and protection in copper and copper alloy thin films
J Li, JW Mayer, EG Colgan
Journal of Applied Physics70, 2820, 1991


1990

PLASMA ETCHING OF TUNGSTEN IN NF3 AND NF3/02
EG COLGAN, PM FRYER, KY AHN
Tungsten and other advanced metals for VLSI/ULSI applications: proceedings of the, pp. 243, 1990

A review of thin-film aluminide formation
EG Colgan
Materials Science Reports 5(1), 1--44, Elsevier, 1990


1989

Growth Behavior of Selectively-deposited Tungsten Films by Silane Reduction
KY Ahn, PM Fryer, JME Harper, RV Joshi, CW Miller, EG Colgan
Tungsten and other refractory metals for VLSI applications IV: proceedings of the 1988 workshop held October 4-6, 1988, Albuquerque, New Mexico, USA, pp. 35, 1989

Comparison of Temperature Control Methods in a Cold Wall Single Wafer LPCVD System
EG Colgan, KY Ahn, and PM Fryer
Tungsten and Other Refractory Metals for VLSI Applications IV, pp. 205, Materials Research Society, 1989

Growth Behavior of Selectively deposited Tyhngsten Films by Silane Reduction
KY Ahn, PM Fryer, JME Harper, RV Joshi, CW Miller, and EG Colgan
Tungsten and Other Refractory Metals for VLSI Applications IV, pp. 35, Materials Research Society, 1989

Thin-film reactions of Al with Co, Cr, Mo, Ta, Ti, and W
EG Colgan, JW Mayer
J. Mater. Res 4(4), 815--820, 1989


1988

Aluminium-Transition Metal Thin-Film Reactions
Colgan, Evan George and Mayer, JW
MRS Online Proceedings Library Archive119, Cambridge University Press, 1988
Abstract


1987

THE KINETICS OF Ni-Al SPINEL GROWTH USING RUTHERFORD BACKSCATTERING SPECTROSCOPY
Y K SIMPSON, EG COLGAN, CB CARTER
MRS Proceedings, vol. 94, 299 (1987), pp. 299

Phase formation and dissociation in the thin-film Pd/Al system
Colgan, EG
Journal of applied physics 62(6), 2269--2274, AIP, 1987
Abstract


Moving Species in Ion-Induced Aluminide Formation
LS Hung, EG Colgan, JW Mayer
Nucl. Instrum. Methods Phys. Res., Sect. B, B 19-20, 654--658, 1987

Kinetics of the growth of spinel on alumina using Rutherford backscattering spectroscopy
Y K Simpson, EG Colgan, C B Carter
Journal of the American Ceramic Society 70(7), 149--151, Blackwell Publishing Ltd, 1987

Hetero- and Homo-Phase Boundaries in Ceramic Oxides
CB Carter, EG Colgan, S McKernan
Interface Science and Engineering'87, 1987


Void formation in thin Al films
EG Colgan, C Y Li, JW Mayer
Applied Physics Letters51, 424, 1987

Phase formation and dissociation in the thin-film Pt/Al system
EG Colgan
Journal of applied physics 62(4), 1224--1231, AIP, 1987


1986

Interfacial reaction of Mo-W alloys with silicon
JO Olowolafe, EG Colgan, CJ Palmstrom, JW Mayer
Thin solid films 138(2), 245--254, Elsevier Science, 1986


Amorphous diffusion barriers in Al-Si and Au-Si contacts
LS Hung, EG Colgan, JW Mayer
Journal of applied physics 60(12), 4177--4181, AIP, 1986

Diffusion markers in Al/metal thin-film reactions
EG Colgan, JW Mayer
Nuclear Instruments and Methods in Physics Research B17, 242--249, 1986


1985


Influence of Cu as an impurity in Al/V thin-film reactions
EG Colgan, CJ Palmstr{o}m, JW Mayer
Journal of applied physics 58(5), 1838--1840, AIP, 1985

Al/TiW reaction kinetics: Influence of Cu and interface oxides
JO Olowolafe, CJ Palmstr{o}m, EG Colgan, JW Mayer
Journal of Applied Physics58, 3440, 1985

Initial phase formation and dissociation in the thin-film Ni/Al system
EG Colgan, M Nastasi, JW Mayer
Journal of Applied Physics58, 4125, 1985


1983

Electrical characteristics of thin Ni 2 Si, NiSi, and NiSi 2 layers grown on silicon
E G Colgan, M Maenpaa, M. Finetti, and M-A Nicolet
Journal of Electronic Materials 12(2), 413--422, Springer, 1983


1981

Contact resistivities of sputtered TiN and Ti-TiN metallizations on solar-cell-type-silicon
M. Maenpaa, M-A Nicolet, I. Suni and E.G. Colgan
Solar Energy 27(4), 283--287, Elsevier, 1981
Abstract


1980

Phase formation in Cr-Si thin-film interactions
EG Colgan, BY Tsaur & JW Mayer
Applied Physics Letters37, 938, 1980