Keishi Okamoto  Keishi Okamoto photo       

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Research Staff Member, Semiconductor packaging
IBM Research - Tokyo, Kawasaki, Japan
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Professional Associations

Professional Associations:  IEEE Member  |  Japan Institute of Electronics Packaging

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More information:  linkedIn


2103

ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES
Noam KAMINSKI, Danny Elad, Evgeny Shumaker, Keishi Okamoto, Kazushige Toriyama
Patent WO2013144862


2016

CIRCUIT BOARD FORMATION USING ORGANIC SUBSTRATES
Hiroyuki Mori, Hirokazu Noma, Keishi Okamoto
Patent US20160057857



2013

HIGH FREQUENCY TRANSITION MATCHING IN AN ELECTRONIC PACKAGE FOR MILLIMETER WAVE SEMICONDUCTOR DIES
Elad Danny, Kaminski Noam, Okamoto Keishi, Shumaker Evgeny, Toriyama Kazushige
Patent US20130256849


2012