Electrical Interconnect and Packaging (Computer Systems Design sub-discipline) - overview
Our mission is to provide innovative interconnect and packaging solutions for supercomputers, servers, client machines and communication systems. We develop advanced on/off-chip interconnect and packaging technologies for heterogeneous 2.5D/3D system integration, VCSEL-based optoelectronic network, silicon photonics and wireless communication. Our community supports best-of-breed electrical and optical I/O co-design, pushes the limits of design and simulation tools, develops new characterization techniques, and implements leading-edge thermal, mechanical and reliability solutions for IBM systems. In addition, we explore new architectural concepts in designing and building prototypes for next-generation computation and communication systems.